2.0(top 20%)
impact factor
15.2K(top 1%)
papers
219.4K(top 2%)
citations
116(top 5%)
h-index
2.0(top 20%)
impact factor
16.4K
all documents
229.9K
doc citations
164(top 5%)
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Top Articles

#TitleJournalYearCitations
1Estimation of the thermal band gap of a semiconductor from seebeck measurementsJournal of Electronic Materials1999684
2Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials2000504
3High Thermoelectric Performance of Dually Doped ZnO CeramicsJournal of Electronic Materials2009370
4Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing ProcessJournal of Electronic Materials2015347
5Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsJournal of Electronic Materials2005344
6A study of deep levels in GaAs by capacitance spectroscopyJournal of Electronic Materials1975339
7Ultraviolet detectors based on epitaxial ZnO films grown by MOCVDJournal of Electronic Materials2000338
8Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials1994319
9Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials1994306
10Automotive Applications of Thermoelectric MaterialsJournal of Electronic Materials2009305
11Nanostructured thermoelectric materialsJournal of Electronic Materials2005301
12Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiJournal of Electronic Materials2002298
13Low-Temperature Sintering with Nano-Silver Paste in Die-Attached InterconnectionJournal of Electronic Materials2007297
14Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion controlJournal of Electronic Materials1998292
15Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic soldersJournal of Electronic Materials1997289
16GaN Technology for Power Electronic Applications: A ReviewJournal of Electronic Materials2016289
17Characterization of eutectic Sn-Bi solder jointsJournal of Electronic Materials1992281
18Thermoelectric quantum-dot superlattices with high ZTJournal of Electronic Materials2000274
19Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials1994262
20MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient HeuristicJournal of Electronic Materials2008261
21A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials1994257
22Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?Journal of Electronic Materials2014249
23Wide-gap semiconductor InGaN and InGaAln grown by MOVPEJournal of Electronic Materials1992246
24Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed ElectronicsJournal of Electronic Materials2011243
25Capillary instabilities in thin filmsJournal of Electronic Materials1990238
26Progress in silicon carbide semiconductor electronics technologyJournal of Electronic Materials1995234
27Bandgap and lattice constant of GaInAsP as a function of alloy compositionJournal of Electronic Materials1974228
28Nickel filament polymer-matrix composites with low surface impedance and high electromagnetic interference shielding effectivenessJournal of Electronic Materials1997227
29Improved oxidation procedures for reduced SiO2/SiC defectsJournal of Electronic Materials1996224
30Excited state polarization, bulk photovoltaic effect and the photorefractive effect in electrically polarized mediaJournal of Electronic Materials1975212
31In search of new lead-free electronic soldersJournal of Electronic Materials1994210
32High thermoelectric figures of merit in PbTe quantum wellsJournal of Electronic Materials1996210
33Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term agingJournal of Electronic Materials1999210
34High-Temperature Capacitor Polymer FilmsJournal of Electronic Materials2014200
35Electron mobility in two-dimensional electron gas in AIGaN/GaN heterostructures and in bulk GaNJournal of Electronic Materials1996197
36Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactionsJournal of Electronic Materials1998197
37Chemical oxidative polymerization as a synthetic route to electrically conducting polypyrrolesJournal of Electronic Materials1986195
38Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stabilityJournal of Electronic Materials2001195
39MBE growth and properties of ZnO on sapphire and SiC substratesJournal of Electronic Materials1996192
40Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applicationsJournal of Electronic Materials2005192
41Preparation of atomically flat surfaces on silicon carbide using hydrogen etchingJournal of Electronic Materials1998188
42Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic DevicesJournal of Electronic Materials2016184
43Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsJournal of Electronic Materials1994182
44Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrateJournal of Electronic Materials2000180
45Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solderJournal of Electronic Materials2003180
46Wearable Thermoelectric Generators for Body-Powered DevicesJournal of Electronic Materials2009180
47“Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance?Journal of Electronic Materials2010179
48Metal contacts to n-type GaNJournal of Electronic Materials1998172
49On the Sn-Bi-Ag ternary phase diagramJournal of Electronic Materials1994171
50Overview of fatigue performance of Cu processed by severe plastic deformationJournal of Electronic Materials1999167