About
Technology
Issues
FAQ
Search
Scientometrics
Impact Factor
Discipline Ranks
h
-index
g
-index
Articles
Citations
Article Citations
Citation Distribution
Overviews
Top Institutions
Top Schools
Top Authors
Prolific Authors
Top Articles
Citing Bodies
Top Citing Authors
Top Citing Institutions
Top Citing Schools
Top Citing Journals
Top Citing Disciplines
exaly
›
Journals
›
Journal of Electronic Materials
›
top-articles
Journal of Electronic Materials
Family Medicine
,
Computer Science
2.0
(top 20%)
impact factor
15.2K
(top 1%)
papers
219.4K
(top 2%)
citations
116
(top 5%)
h
-index
2.0
(top 20%)
impact factor
16.4K
all documents
229.9K
doc citations
164
(top 5%)
g
-index
Top Articles
#
Title
Journal
Year
Citations
1
Estimation of the thermal band gap of a semiconductor from seebeck measurements
Journal of Electronic Materials
1999
684
2
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Journal of Electronic Materials
2000
504
3
High Thermoelectric Performance of Dually Doped ZnO Ceramics
Journal of Electronic Materials
2009
370
4
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process
Journal of Electronic Materials
2015
347
5
Thermal behavior of silver nanoparticles for low-temperature interconnect applications
Journal of Electronic Materials
2005
344
6
A study of deep levels in GaAs by capacitance spectroscopy
Journal of Electronic Materials
1975
339
7
Ultraviolet detectors based on epitaxial ZnO films grown by MOCVD
Journal of Electronic Materials
2000
338
8
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
Journal of Electronic Materials
1994
319
9
Lead (Pb)-free solders for electronic packaging
Journal of Electronic Materials
1994
306
10
Automotive Applications of Thermoelectric Materials
Journal of Electronic Materials
2009
305
11
Nanostructured thermoelectric materials
Journal of Electronic Materials
2005
301
12
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
Journal of Electronic Materials
2002
298
13
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Journal of Electronic Materials
2007
297
14
Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control
Journal of Electronic Materials
1998
292
15
Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
Journal of Electronic Materials
1997
289
16
GaN Technology for Power Electronic Applications: A Review
Journal of Electronic Materials
2016
289
17
Characterization of eutectic Sn-Bi solder joints
Journal of Electronic Materials
1992
281
18
Thermoelectric quantum-dot superlattices with high ZT
Journal of Electronic Materials
2000
274
19
Microstructure evolution of eutectic Sn-Ag solder joints
Journal of Electronic Materials
1994
262
20
MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient Heuristic
Journal of Electronic Materials
2008
261
21
A viable tin-lead solder substitute: Sn-Ag-Cu
Journal of Electronic Materials
1994
257
22
Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Journal of Electronic Materials
2014
249
23
Wide-gap semiconductor InGaN and InGaAln grown by MOVPE
Journal of Electronic Materials
1992
246
24
Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics
Journal of Electronic Materials
2011
243
25
Capillary instabilities in thin films
Journal of Electronic Materials
1990
238
26
Progress in silicon carbide semiconductor electronics technology
Journal of Electronic Materials
1995
234
27
Bandgap and lattice constant of GaInAsP as a function of alloy composition
Journal of Electronic Materials
1974
228
28
Nickel filament polymer-matrix composites with low surface impedance and high electromagnetic interference shielding effectiveness
Journal of Electronic Materials
1997
227
29
Improved oxidation procedures for reduced SiO2/SiC defects
Journal of Electronic Materials
1996
224
30
Excited state polarization, bulk photovoltaic effect and the photorefractive effect in electrically polarized media
Journal of Electronic Materials
1975
212
31
In search of new lead-free electronic solders
Journal of Electronic Materials
1994
210
32
High thermoelectric figures of merit in PbTe quantum wells
Journal of Electronic Materials
1996
210
33
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
Journal of Electronic Materials
1999
210
34
High-Temperature Capacitor Polymer Films
Journal of Electronic Materials
2014
200
35
Electron mobility in two-dimensional electron gas in AIGaN/GaN heterostructures and in bulk GaN
Journal of Electronic Materials
1996
197
36
Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions
Journal of Electronic Materials
1998
197
37
Chemical oxidative polymerization as a synthetic route to electrically conducting polypyrroles
Journal of Electronic Materials
1986
195
38
Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
Journal of Electronic Materials
2001
195
39
MBE growth and properties of ZnO on sapphire and SiC substrates
Journal of Electronic Materials
1996
192
40
Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applications
Journal of Electronic Materials
2005
192
41
Preparation of atomically flat surfaces on silicon carbide using hydrogen etching
Journal of Electronic Materials
1998
188
42
Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices
Journal of Electronic Materials
2016
184
43
Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings
Journal of Electronic Materials
1994
182
44
Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
Journal of Electronic Materials
2000
180
45
Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder
Journal of Electronic Materials
2003
180
46
Wearable Thermoelectric Generators for Body-Powered Devices
Journal of Electronic Materials
2009
180
47
“Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance?
Journal of Electronic Materials
2010
179
48
Metal contacts to n-type GaN
Journal of Electronic Materials
1998
172
49
On the Sn-Bi-Ag ternary phase diagram
Journal of Electronic Materials
1994
171
50
Overview of fatigue performance of Cu processed by severe plastic deformation
Journal of Electronic Materials
1999
167
site/software ©
exaly
; All materials licenced under
CC by-SA
.