2.0(top 20%)
impact factor
15.8K(top 1%)
papers
227.8K(top 2%)
citations
119(top 5%)
h-index
2.1(top 50%)
extended IF
16.8K
all documents
239.0K
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166(top 5%)
g-index

Top Articles

#TitleJournalYearCitations
1Estimation of the thermal band gap of a semiconductor from seebeck measurementsJournal of Electronic Materials1999703
2Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials2000510
3High Thermoelectric Performance of Dually Doped ZnO CeramicsJournal of Electronic Materials2009376
4Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing ProcessJournal of Electronic Materials2015375
5Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsJournal of Electronic Materials2005349
6Ultraviolet detectors based on epitaxial ZnO films grown by MOCVDJournal of Electronic Materials2000341
7A study of deep levels in GaAs by capacitance spectroscopyJournal of Electronic Materials1975339
8Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials1994320
9GaN Technology for Power Electronic Applications: A ReviewJournal of Electronic Materials2016314
10Automotive Applications of Thermoelectric MaterialsJournal of Electronic Materials2009311
11Nanostructured thermoelectric materialsJournal of Electronic Materials2005309
12Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials1994306
13Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiJournal of Electronic Materials2002302
14Low-Temperature Sintering with Nano-Silver Paste in Die-Attached InterconnectionJournal of Electronic Materials2007301
15Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion controlJournal of Electronic Materials1998297
16Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic soldersJournal of Electronic Materials1997291
17Characterization of eutectic Sn-Bi solder jointsJournal of Electronic Materials1992287
18Thermoelectric quantum-dot superlattices with high ZTJournal of Electronic Materials2000277
19MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient HeuristicJournal of Electronic Materials2008271
20Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials1994263
21A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials1994260
22Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?Journal of Electronic Materials2014259
23Wide-gap semiconductor InGaN and InGaAln grown by MOVPEJournal of Electronic Materials1992247
24Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed ElectronicsJournal of Electronic Materials2011247
25Capillary instabilities in thin filmsJournal of Electronic Materials1990243
26Progress in silicon carbide semiconductor electronics technologyJournal of Electronic Materials1995237
27Nickel filament polymer-matrix composites with low surface impedance and high electromagnetic interference shielding effectivenessJournal of Electronic Materials1997231
28Bandgap and lattice constant of GaInAsP as a function of alloy compositionJournal of Electronic Materials1974228
29Improved oxidation procedures for reduced SiO2/SiC defectsJournal of Electronic Materials1996224
30High-Temperature Capacitor Polymer FilmsJournal of Electronic Materials2014219
31Excited state polarization, bulk photovoltaic effect and the photorefractive effect in electrically polarized mediaJournal of Electronic Materials1975213
32High thermoelectric figures of merit in PbTe quantum wellsJournal of Electronic Materials1996213
33In search of new lead-free electronic soldersJournal of Electronic Materials1994211
34Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term agingJournal of Electronic Materials1999211
35Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic DevicesJournal of Electronic Materials2016201
36Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stabilityJournal of Electronic Materials2001200
37Electron mobility in two-dimensional electron gas in AIGaN/GaN heterostructures and in bulk GaNJournal of Electronic Materials1996199
38Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactionsJournal of Electronic Materials1998197
39Chemical oxidative polymerization as a synthetic route to electrically conducting polypyrrolesJournal of Electronic Materials1986195
40MBE growth and properties of ZnO on sapphire and SiC substratesJournal of Electronic Materials1996192
41Preparation of atomically flat surfaces on silicon carbide using hydrogen etchingJournal of Electronic Materials1998192
42Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applicationsJournal of Electronic Materials2005192
43Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsJournal of Electronic Materials1994184
44“Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance?Journal of Electronic Materials2010183
45Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrateJournal of Electronic Materials2000180
46Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solderJournal of Electronic Materials2003180
47Wearable Thermoelectric Generators for Body-Powered DevicesJournal of Electronic Materials2009180
48On the Sn-Bi-Ag ternary phase diagramJournal of Electronic Materials1994173
49Metal contacts to n-type GaNJournal of Electronic Materials1998173
50Overview of fatigue performance of Cu processed by severe plastic deformationJournal of Electronic Materials1999167