Citation of paper, Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Authors Citing This Paper

AuthorCiting PapersAuthor's PapersAuthor's CitationsAuthor's IF
Paul Conway131841,9350.9
Chunqing Wang112202,7631.3
Jae Pil Jung10931,0712
Ahmed Sharif10651,3521.7
Zhong Chen1061327,0037.8
Kazuhiro Nogita92096,0612.8
Shih-kang Lin8721,0872.4
Zhi-Quan Liu81334,1023.2
Michael G Pecht782519,7763.3
Stuart D Mcdonald71032,4452.8
Chih-Ming Chen61432,4661.9
Guo-Jun Qi61314,7566.1
Cheol-Woong Yang61204,5323.8
Xiu-Chen Zhao6537793.2
Jianfeng Li6621,6792.2
Vadim V Silberschmidt55237,9212
Christian Leinenbach51363,4274.6
Jenn-Ming Song5921,2611
Qingke Zhang5334322.3
Wojciech Gierlotka5737291.1
Tomi Laurila51343,8783.5
Vesa Ho Vuorinen5802,2902.3
Tsung-Chieh Chiu5121281.1
Kuan-Neng Chen41451,7581.2
Anil Kunwar4483741.4
Han Huang43098,3383.8
Cai-Fu Li4519773.7
Shuye Zhang4527394.4
Hua-Jie Yang4581,7895.1
Christopher Mark Johnson41091,6011.9
Yang Liu4724901.4
Huajie Yang4251,0403.6
Md Jahir Rizvi410
Joanna Wojewoda-Budka4342922.2
Chien-Lung Liang3201532
Hideyuki Yasuda32053,1571.7
Justin H Chow312911.2
Chris Bailey3774280.6
Alaa F Abd El-Rehim3514675.2
Praveen Kumar3988581.5
Hongjun Ji3771,3483.8
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Anna Wierzbicka-Miernik3482921.5
Sabuj Mallik3244632.8
Wei Zhou32325,0972.2
Libor Rufer3583250.6
Byungmin Ahn3941,8963.4
Lidia Litynska-Dobrzynska31061,1802.1
Linmei Yang3133783.1
Boxin Zhao21093,7945.8

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JournalCiting PapersJournal's IFJournal's Star
Journal of Electronic Materials1531.9★★★
Journal of Alloys and Compounds845.7★★★
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Journal of Materials Research412.5★★★
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing295.3★★★
Soldering and Surface Mount Technology191.4★★★
Journal of Applied Physics182.5★★★
Acta Materialia178.4★★★
Materials Letters153.3★★★
Intermetallics143.5★★★
Scripta Materialia145.6★★★
Journal of Materials Science134.3★★★
Materials Transactions101.3★★★
Jom102.1★★★
Advanced Materials Research90.5
IEEE Transactions on Components, Packaging and Manufacturing Technology91.7★★★
Transactions of Nonferrous Metals Society of China93.3★★★
Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science92.3★★★
Materials Chemistry and Physics94.4★★★
Materials Science Forum80.4★★★
Journal of Electronic Packaging, Transactions of the ASME82★★★
IEEE Transactions on Components and Packaging Technologies7
Materials Science and Engineering B: Solid-State Materials for Advanced Technology73.1★★★
Applied Surface Science76.7★★★
Applied Physics Letters73.4★★★
Calphad: Computer Coupling of Phase Diagrams and Thermochemistry61.9★★★
Materials and Design68.1★★★
Materials63.5
Thin Solid Films62.2★★★
Electronic Materials Letters52.9
Metals and Materials International52.4★★★
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Scientific Reports44.9★★★
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