IEEE Transactions on Electronics Packaging Manufacturing

1.4(top 50%)

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564(top 50%)

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10.5K(top 20%)

citations

48(top 20%)

h-index

1.4(top 50%)

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750

all documents

11.3K

doc citations

79(top 10%)

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Top Articles

#	Title	Journal	Year	Citations
1	The Changing Automotive Environment: High-Temperature Electronics	IEEE Transactions on Electronics Packaging Manufacturing	2004	657
2	Electron beam lithography in nanoscale fabrication: recent development	IEEE Transactions on Electronics Packaging Manufacturing	2003	357
3	Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow	IEEE Transactions on Electronics Packaging Manufacturing	2002	180
4	Annotated tin whisker bibliography and anthology	IEEE Transactions on Electronics Packaging Manufacturing	2005	174
5	Fine-line conductor manufacturing using drop-on demand PZT printing technology	IEEE Transactions on Electronics Packaging Manufacturing	2002	165
6	Rough set theory: a data mining tool for semiconductor manufacturing	IEEE Transactions on Electronics Packaging Manufacturing	2001	162
7	Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives	IEEE Transactions on Electronics Packaging Manufacturing	1999	157
8	Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils	IEEE Transactions on Electronics Packaging Manufacturing	2010	140
9	Printed circuit board recycling: a state-of-the-art survey	IEEE Transactions on Electronics Packaging Manufacturing	2004	135
10	Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices	IEEE Transactions on Electronics Packaging Manufacturing	2007	130
11	TLP calibration, correlation, standards, and new techniques	IEEE Transactions on Electronics Packaging Manufacturing	2001	129
12	An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses	IEEE Transactions on Electronics Packaging Manufacturing	2005	123
13	Micropositioning of a weakly calibrated microassembly system using coarse-to-fine visual servoing strategies	IEEE Transactions on Electronics Packaging Manufacturing	2000	122
14	Theory of Tin Whisker Growth: “The End Game”	IEEE Transactions on Electronics Packaging Manufacturing	2007	121
15	Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards	IEEE Transactions on Electronics Packaging Manufacturing	2002	112
16	Mechanisms underlying the unstable contact resistance of conductive adhesives	IEEE Transactions on Electronics Packaging Manufacturing	1999	99
17	Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits	IEEE Transactions on Electronics Packaging Manufacturing	2005	98
18	Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy	IEEE Transactions on Electronics Packaging Manufacturing	2009	95
19	Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling	IEEE Transactions on Electronics Packaging Manufacturing	2007	92
20	Power Device Packaging Technologies for Extreme Environments	IEEE Transactions on Electronics Packaging Manufacturing	2007	92
21	Decomposition in data mining: an industrial case study	IEEE Transactions on Electronics Packaging Manufacturing	2000	86
22	Feature transformation methods in data mining	IEEE Transactions on Electronics Packaging Manufacturing	2001	86
23	Conductivity mechanisms of isotropic conductive adhesives (ICAs)	IEEE Transactions on Electronics Packaging Manufacturing	1999	82
24	Low stress packaging of a micromachined accelerometer	IEEE Transactions on Electronics Packaging Manufacturing	2001	78
25	Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization	IEEE Transactions on Electronics Packaging Manufacturing	2005	78
26	Solder joints inspection using a neural network and fuzzy rule-based classification method	IEEE Transactions on Electronics Packaging Manufacturing	2000	75
27	Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages	IEEE Transactions on Electronics Packaging Manufacturing	2002	75
28	Critical Variables of Solder Paste Stencil Printing for Micro-BGA and Fine-Pitch QFP	IEEE Transactions on Electronics Packaging Manufacturing	2004	75
29	Sn Corrosion and Its Influence on Whisker Growth	IEEE Transactions on Electronics Packaging Manufacturing	2007	70
30	Colloidal processing of polymer ceramic nanocomposite integral capacitors	IEEE Transactions on Electronics Packaging Manufacturing	2003	68
31	The Impact of Lead-Free Legislation Exemptions on the Electronics Industry	IEEE Transactions on Electronics Packaging Manufacturing	2004	68
32	Drop-on-Demand Solder Droplet Jetting System for Fabricating Microstructure	IEEE Transactions on Electronics Packaging Manufacturing	2008	68
33	Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis	IEEE Transactions on Electronics Packaging Manufacturing	2008	67
34	DMAIC Approach to Improve the Capability of SMT Solder Printing Process	IEEE Transactions on Electronics Packaging Manufacturing	2008	64
35	The current status of lead-free solder alloys	IEEE Transactions on Electronics Packaging Manufacturing	2001	63
36	Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects	IEEE Transactions on Electronics Packaging Manufacturing	2005	63
37	Interfacial reaction studies on lead (Pb)-free solder alloys	IEEE Transactions on Electronics Packaging Manufacturing	2002	62
38	Comprehensive treatment of moisture induced failure-recent advances	IEEE Transactions on Electronics Packaging Manufacturing	2002	60
39	Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board	IEEE Transactions on Electronics Packaging Manufacturing	2002	60
40	Statistical methods for the estimation of process variation effects on circuit operation	IEEE Transactions on Electronics Packaging Manufacturing	2005	59
41	Effects of Defects on the Thermal and Optical Performance of High-Brightness Light-Emitting Diodes	IEEE Transactions on Electronics Packaging Manufacturing	2009	58
42	Isotropic conductive adhesives filled with low-melting-point alloy fillers	IEEE Transactions on Electronics Packaging Manufacturing	2000	57
43	Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux	IEEE Transactions on Electronics Packaging Manufacturing	2006	57
44	In-situ stress state measurements during chip-on-board assembly	IEEE Transactions on Electronics Packaging Manufacturing	1999	55
45	Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory	IEEE Transactions on Electronics Packaging Manufacturing	2005	54
46	Humidity Effects on Sn Whisker Formation	IEEE Transactions on Electronics Packaging Manufacturing	2006	54
47	Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds	IEEE Transactions on Electronics Packaging Manufacturing	2006	53
48	The absorption ink transfer mechanism of gravure offset printing for electronic circuitry	IEEE Transactions on Electronics Packaging Manufacturing	2002	52
49	Flip Chip Assembly of Thinned Silicon Die on Flex Substrates	IEEE Transactions on Electronics Packaging Manufacturing	2008	52
50	Comparative study of fluid dispensing modeling	IEEE Transactions on Electronics Packaging Manufacturing	2003	49

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