# | Title | Journal | Year | Citations |
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1 | Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process) | Microelectronic Engineering | 1986 | 1,058 |
2 | Carbon nanotubes in interconnect applications | Microelectronic Engineering | 2002 | 566 |
3 | Nanofabrication by electron beam lithography and its applications: A review | Microelectronic Engineering | 2015 | 509 |
4 | Point-of-care testing (POCT) diagnostic systems using microfluidic lab-on-a-chip technologies | Microelectronic Engineering | 2015 | 403 |
5 | PDMS-based microfluidic devices for biomedical applications | Microelectronic Engineering | 2002 | 399 |
6 | Lab-on-a-chip devices: How to close and plug the lab? | Microelectronic Engineering | 2015 | 388 |
7 | Towards implementation of a nickel silicide process for CMOS technologies | Microelectronic Engineering | 2003 | 387 |
8 | Optimization of poly-di-methyl-siloxane (PDMS) substrates for studying cellular adhesion and motility | Microelectronic Engineering | 2008 | 367 |
9 | Imprint lithography with sub-10 nm feature size and high throughput | Microelectronic Engineering | 1997 | 353 |
10 | Ultrathin high-K metal oxides on silicon: processing, characterization and integration issues | Microelectronic Engineering | 2001 | 346 |
11 | Flow behaviour of thin polymer films used for hot embossing lithography | Microelectronic Engineering | 2000 | 344 |
12 | Formation of more stable hydrophilic surfaces of PDMS by plasma and chemical treatments | Microelectronic Engineering | 2006 | 331 |
13 | Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices | Microelectronic Engineering | 2018 | 329 |
14 | On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors | Microelectronic Engineering | 2006 | 325 |
15 | Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices | Microelectronic Engineering | 2007 | 320 |
16 | Novel hydrogen gas sensor based on single ZnO nanorod | Microelectronic Engineering | 2008 | 320 |
17 | Measurement of nonlinear mechanical properties of PDMS elastomer | Microelectronic Engineering | 2011 | 302 |
18 | NiSi salicide technology for scaled CMOS | Microelectronic Engineering | 2002 | 283 |
19 | Ultrathin HfO2 films grown on silicon by atomic layer deposition for advanced gate dielectrics applications | Microelectronic Engineering | 2003 | 275 |
20 | Direct laser writing: Principles and materials for scaffold 3D printing | Microelectronic Engineering | 2015 | 272 |
21 | Hierarchical roughness makes superhydrophobic states stable | Microelectronic Engineering | 2007 | 258 |
22 | Gold cleaning methods for electrochemical detection applications | Microelectronic Engineering | 2009 | 257 |
23 | A comparative study of Pd/Sn/Au, Au/Ge/Au/Ni/Au, Au-Ge/Ni and Ni/Au-Ge/Ni ohmic contacts to n-GaAs | Microelectronic Engineering | 1998 | 250 |
24 | Improving stamps for 10 nm level wafer scale nanoimprint lithography | Microelectronic Engineering | 2002 | 250 |
25 | Roadmap for 22nm and beyond (Invited Paper) | Microelectronic Engineering | 2009 | 245 |
26 | Brain-inspired computing with resistive switching memory (RRAM): Devices, synapses and neural networks | Microelectronic Engineering | 2018 | 231 |
27 | Beyond the lateral flow assay: A review of paper-based microfluidics | Microelectronic Engineering | 2019 | 230 |
28 | Fabrication and characterization of heterostructures with subnanometer thickness | Microelectronic Engineering | 1984 | 219 |
29 | High-k dielectrics for future generation memory devices (Invited Paper) | Microelectronic Engineering | 2009 | 218 |
30 | Development of a flexible PDMS capacitive pressure sensor for plantar pressure measurement | Microelectronic Engineering | 2012 | 213 |
31 | Multi-gate SOI MOSFETs | Microelectronic Engineering | 2007 | 207 |
32 | Superhydrophobic surfaces fabricated by nanoimprint lithography | Microelectronic Engineering | 2006 | 204 |
33 | Fabrication of diffraction gratings for hard X-ray phase contrast imaging | Microelectronic Engineering | 2007 | 204 |
34 | A contribution to the flow behaviour of thin polymer films during hot embossing lithography | Microelectronic Engineering | 2001 | 194 |
35 | Design and dynamics of a 3-DOF flexure-based parallel mechanism for micro/nano manipulation | Microelectronic Engineering | 2010 | 194 |
36 | Influence of the electron mean free path on the resistivity of thin metal films | Microelectronic Engineering | 2004 | 193 |
37 | Graphene and carbon nanotube (CNT) in MEMS/NEMS applications | Microelectronic Engineering | 2015 | 191 |
38 | An overview of through-silicon-via technology and manufacturing challenges | Microelectronic Engineering | 2015 | 190 |
39 | Pattern transfer: Self-assembled monolayers as ultrathin resists | Microelectronic Engineering | 1996 | 187 |
40 | Hierarchical micro and nano structured, hydrophilic, superhydrophobic and superoleophobic surfaces incorporated in microfluidics, microarrays and lab on chip microsystems | Microelectronic Engineering | 2015 | 187 |
41 | Electron beam lithography—Resolution limits | Microelectronic Engineering | 1996 | 184 |
42 | Challenges, developments and applications of silicon deep reactive ion etching | Microelectronic Engineering | 2003 | 180 |
43 | An overview of supercritical CO2 applications in microelectronics processing | Microelectronic Engineering | 2003 | 180 |
44 | One-step 3D shaping using a gray-tone mask for optical and microelectronic applications | Microelectronic Engineering | 1994 | 179 |
45 | Ultrahigh density, high-data-rate NEMS-based AFM data storage system | Microelectronic Engineering | 1999 | 179 |
46 | Micropumps and biomedical applications – A review | Microelectronic Engineering | 2018 | 178 |
47 | Temperature and frequency dependent electrical and dielectric properties of Al/SiO2/p-Si (MOS) structure | Microelectronic Engineering | 2005 | 170 |
48 | Sub-50 nm period patterns with EUV interference lithography | Microelectronic Engineering | 2003 | 168 |
49 | Dielectric spectroscopy studies on (PVP+PVA) polyblend film | Microelectronic Engineering | 2006 | 168 |
50 | High-temperature lead-free solder alternatives | Microelectronic Engineering | 2011 | 167 |