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#TitleJournalYearCitations
1Synthesis of Large‐Area Graphene Layers on Poly‐Nickel Substrate by Chemical Vapor Deposition: Wrinkle FormationAdvanced Materials2009814
2Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealingJournal of Alloys and Compounds2005301
3The joint properties of copper by friction stir weldingMaterials Letters2004236
4The improvement of mechanical properties of friction-stir-welded A356 Al alloyMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing2003167
5The joint properties of dissimilar formed Al alloys by friction stir welding according to the fixed location of materialsScripta Materialia2003158
6Corrosion behavior of steel bar embedded in fly ash concreteCorrosion Science2006143
7A study on corrosion resistance characteristics of PVD Cr-N coated steels by electrochemical methodSurface and Coatings Technology2002116
8Alpha-case formation mechanism on titanium investment castingsMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing2005112
9IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrateJournal of Alloys and Compounds2005112
10Effects of Cr, Cu, Ni and Ca on the corrosion behavior of low carbon steel in synthetic tap waterJournal of Alloys and Compounds2005111
11Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrateJournal of Alloys and Compounds2005109
12Corrosion behavior of TiN, TiAlN, TiAlSiN thin films deposited on tool steel in the 3.5 wt.% NaCl solutionThin Solid Films2008109
13Mechanical Properties Related to Microstructural Variation of 6061 Al Alloy Joints by Friction Stir WeldingMaterials Transactions2004107
14Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term agingJournal of Alloys and Compounds2005105
15Localized corrosion mechanisms of the multilayered coatings related to growth defectsSurface and Coatings Technology200492
16Corrosion performance of diamond-like carbon (DLC)-coated Ti alloy in the simulated body fluid environmentDiamond and Related Materials200592
17A study on the quantitative determination of through-coating porosity in PVD-grown coatingsApplied Surface Science200490
18Large-scale production of aligned carbon nanotubes by the vapor phase growth methodChemical Physics Letters200289
19Microstructures and wear property of friction stir welded AZ91 Mg/SiC particle reinforced compositeComposites Science and Technology200689
20Electrochemical performance of lithium-ion batteries with triphenylphosphate as a flame-retardant additiveJournal of Power Sources200789
21Design of Dispersants for the Dispersion of Carbon Nanotubes in an Organic SolventAdvanced Functional Materials200787
22Effect of tin on the corrosion behavior of low-alloy steel in an acid chloride solutionCorrosion Science201087
23Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu SolderMaterials Transactions200286
24Influence of Eu3+, Bi3+ co-doping content on photoluminescence of YVO4 red phosphors induced by ultraviolet excitationSensors and Actuators B: Chemical200784
25Corrosion characteristics of polyaniline-coated 316L stainless steel in sulphuric acid containing fluorideCorrosion Science200984
26Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatmentJournal of Electronic Materials200383
27Effects of copper insert layer on the properties of friction welded joints between TiAl and AISI 4140 structural steelIntermetallics200483
28Atomic layer etching of graphene for full graphene device fabricationCarbon201280
29Investigation of interfacial reactions between Sn–5Bi solder and Cu substrateJournal of Alloys and Compounds200379
30Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reactionJournal of Alloys and Compounds200579
31The Joint Characteristics of Friction Stir Welded AZ91D Magnesium AlloyMaterials Transactions200378
32Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallizationJournal of Electronic Materials200478
33Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder jointsMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing200475
34Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solderJournal of Electronic Materials200474
35IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During AgingMaterials Transactions200471
36Copper corrosion in potable water distribution systems: influence of copper products on the corrosion behaviorMaterials Letters200468
37Effects of cover gases on melt protection of Mg alloysJournal of Alloys and Compounds200668
38Electrochemical behavior of diamond-like carbon films for biomedical applicationsThin Solid Films200567
39Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) SubstrateMaterials Transactions200266
40Effects of Cr3C2 on the microstructure and mechanical properties of the brazed joints between WC–Co and carbon steelInternational Journal of Refractory Metals and Hard Materials200665
41Effect of nitrite concentration on the corrosion behaviour of carbon steel pipelines in synthetic tap waterCorrosion Science201265
42Effects of functional electrolyte additives for Li-ion batteriesJournal of Power Sources200764
43Effect of antimony on the corrosion behavior of low-alloy steel for flue gas desulfurization systemCorrosion Science200863
44Effect of Si addition to CrN coatings on the corrosion resistance of CrN/stainless steel coating/substrate system in a deaerated 3.5 wt.% NaCl solutionSurface and Coatings Technology200762
45Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrateJournal of Alloys and Compounds200461
46Effect of reflow time on interfacial reaction and shear strength of Sn–0.7Cu solder/Cu and electroless Ni–P BGA jointsJournal of Alloys and Compounds200460
47Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrateJournal of Materials Science200458
48Synthesis of single- and double-walled carbon nanotubes by catalytic decomposition of methaneChemical Physics Letters200357
49Diphenyloctyl phosphate as a flame-retardant additive in electrolyte for Li-ion batteriesJournal of Power Sources200857
50Direct Metallization of Gold Nanoparticles on a Polystyrene Bead Surface using Cationic Gold LigandsMacromolecular Rapid Communications200756