IEEE Transactions on Components and Packaging Technologies

1.3(top 50%)

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1.3K(top 20%)

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31.2K(top 10%)

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77(top 10%)

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1.5K

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33.4K

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116(top 10%)

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Top Articles

#	Title	Journal	Year	Citations
1	Assessment of high-heat-flux thermal management schemes	IEEE Transactions on Components and Packaging Technologies	2001	650
2	Dynamic lithium-ion battery model for system simulation	IEEE Transactions on Components and Packaging Technologies	2002	608
3	Power and life extension of battery-ultracapacitor hybrids	IEEE Transactions on Components and Packaging Technologies	2002	436
4	Prognostics and health management of electronics	IEEE Transactions on Components and Packaging Technologies	2006	370
5	Thermal Challenges in Next-Generation Electronic Systems	IEEE Transactions on Components and Packaging Technologies	2008	352
6	Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material	IEEE Transactions on Components and Packaging Technologies	2006	310
7	Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials	IEEE Transactions on Components and Packaging Technologies	2007	292
8	Four decades of research on thermal contact, gap, and joint resistance in microelectronics	IEEE Transactions on Components and Packaging Technologies	2005	256
9	A precise numerical prediction of effective dielectric constant for polymer-ceramic composite based on effective-medium theory	IEEE Transactions on Components and Packaging Technologies	2000	223
10	Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints	IEEE Transactions on Components and Packaging Technologies	2008	209
11	Printed organic transistors for ultra-low-cost RFID applications	IEEE Transactions on Components and Packaging Technologies	2005	205
12	Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips	IEEE Transactions on Components and Packaging Technologies	2010	200
13	Contact physics of gold microcontacts for MEMS switches	IEEE Transactions on Components and Packaging Technologies	1999	194
14	Closed-loop electroosmotic microchannel cooling system for VLSI circuits	IEEE Transactions on Components and Packaging Technologies	2002	191
15	Electrical breakdown in atmospheric air between closely spaced (0.2 μm-40 μm) electrical contacts	IEEE Transactions on Components and Packaging Technologies	2002	188
16	Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability	IEEE Transactions on Components and Packaging Technologies	2003	178
17	Optimization of plate fin heat sinks using entropy generation minimization	IEEE Transactions on Components and Packaging Technologies	2001	171
18	A Practical Implementation of Silicon Microchannel Coolers for High Power Chips	IEEE Transactions on Components and Packaging Technologies	2007	168
19	Microjet cooling devices for thermal management of electronics	IEEE Transactions on Components and Packaging Technologies	2003	158
20	Electrical contact resistance: properties of stationary interfaces	IEEE Transactions on Components and Packaging Technologies	1999	157
21	PCM thermal control unit for portable electronic devices: experimental and numerical studies	IEEE Transactions on Components and Packaging Technologies	2003	145
22	Thermal cycling analysis of flip-chip solder joint reliability	IEEE Transactions on Components and Packaging Technologies	2001	142
23	Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannels	IEEE Transactions on Components and Packaging Technologies	2001	140
24	Analytical and Numerical Modeling of the Thermal Performance of Three-Dimensional Integrated Circuits	IEEE Transactions on Components and Packaging Technologies	2010	134
25	Optimization study of stacked micro-channel heat sinks for micro-electronic cooling	IEEE Transactions on Components and Packaging Technologies	2003	131
26	Current and future miniature refrigeration cooling technologies for high power microelectronics	IEEE Transactions on Components and Packaging Technologies	2002	129
27	Electronic part life cycle concepts and obsolescence forecasting	IEEE Transactions on Components and Packaging Technologies	2000	126
28	Two-Phase Spray Cooling of Hybrid Vehicle Electronics	IEEE Transactions on Components and Packaging Technologies	2009	125
29	Miniature loop heat pipes-a promising means for cooling electronics	IEEE Transactions on Components and Packaging Technologies	2005	124
30	A life consumption monitoring methodology for electronic systems	IEEE Transactions on Components and Packaging Technologies	2003	123
31	Carbon Nanotube Applications in Microelectronics	IEEE Transactions on Components and Packaging Technologies	2004	121
32	Low-Temperature Two-Phase Microchannel Cooling for High-Heat-Flux Thermal Management of Defense Electronics	IEEE Transactions on Components and Packaging Technologies	2009	119
33	Scaling and Optimization of Gravure-Printed Silver Nanoparticle Lines for Printed Electronics	IEEE Transactions on Components and Packaging Technologies	2010	117
34	Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass	IEEE Transactions on Components and Packaging Technologies	2001	116
35	Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging	IEEE Transactions on Components and Packaging Technologies	2003	115
36	Geometric optimization of a micro heat sink with liquid flow	IEEE Transactions on Components and Packaging Technologies	2006	112
37	An improved methodology for determining temperature dependent moduli of underfill encapsulants	IEEE Transactions on Components and Packaging Technologies	2000	111
38	Model for BGA and CSP Reliability in Automotive Underhood Applications	IEEE Transactions on Components and Packaging Technologies	2004	111
39	A novel hybrid heat sink using phase change materials for transient thermal management of electronics	IEEE Transactions on Components and Packaging Technologies	2005	111
40	Measuring partial thermal resistances in a heat-flow path	IEEE Transactions on Components and Packaging Technologies	2002	109
41	Compact thermal models for electronic systems	IEEE Transactions on Components and Packaging Technologies	2003	108
42	Thermal investigation of high power Optical Devices by transient testing	IEEE Transactions on Components and Packaging Technologies	2005	108
43	Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages	IEEE Transactions on Components and Packaging Technologies	2004	105
44	Double-sided cooling for high power IGBT modules using flip chip technology	IEEE Transactions on Components and Packaging Technologies	2001	100
45	Silver-indium joints produced at low temperature for high temperature devices	IEEE Transactions on Components and Packaging Technologies	2002	100
46	Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices	IEEE Transactions on Components and Packaging Technologies	2010	98
47	Experimental Investigation of a Miniature-Scale Refrigeration System for Electronics Cooling	IEEE Transactions on Components and Packaging Technologies	2006	97
48	Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits	IEEE Transactions on Components and Packaging Technologies	2001	96
49	TCPT-2006-096.R2: Micro Scale pin fin Heat Sinks —Parametric Performance Evaluation Study	IEEE Transactions on Components and Packaging Technologies	2007	96
50	High heat flux heat pipe mechanism for cooling of electronics	IEEE Transactions on Components and Packaging Technologies	2001	95

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IEEE Transactions on Components and Packaging Technologies

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