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IEEE Transactions on Semiconductor Manufacturing
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top-articles
IEEE Transactions on Semiconductor Manufacturing
2.6
(top 20%)
impact factor
2.3K
(top 10%)
papers
39.5K
(top 10%)
citations
85
(top 10%)
h
-index
2.6
(top 20%)
impact factor
2.9K
all documents
43.0K
doc citations
126
(top 10%)
g
-index
Top Articles
#
Title
Journal
Year
Citations
1
Scheduling semiconductor wafer fabrication
IEEE Transactions on Semiconductor Manufacturing
1988
565
2
Material removal mechanism in chemical mechanical polishing: theory and modeling
IEEE Transactions on Semiconductor Manufacturing
2001
498
3
Fifty Years of Moore's Law
IEEE Transactions on Semiconductor Manufacturing
2011
432
4
A Convolutional Neural Network for Fault Classification and Diagnosis in Semiconductor Manufacturing Processes
IEEE Transactions on Semiconductor Manufacturing
2017
347
5
Efficient scheduling policies to reduce mean and variance of cycle-time in semiconductor manufacturing plants
IEEE Transactions on Semiconductor Manufacturing
1994
346
6
Fault Detection Using the k-Nearest Neighbor Rule for Semiconductor Manufacturing Processes
IEEE Transactions on Semiconductor Manufacturing
2007
345
7
VARIUS: A Model of Process Variation and Resulting Timing Errors for Microarchitects
IEEE Transactions on Semiconductor Manufacturing
2008
313
8
Closed-loop job release control for VLSI circuit manufacturing
IEEE Transactions on Semiconductor Manufacturing
1988
308
9
Run by run process control: combining SPC and feedback control
IEEE Transactions on Semiconductor Manufacturing
1995
280
10
The use and evaluation of yield models in integrated circuit manufacturing
IEEE Transactions on Semiconductor Manufacturing
1990
273
11
Wafer Map Defect Pattern Classification and Image Retrieval Using Convolutional Neural Network
IEEE Transactions on Semiconductor Manufacturing
2018
272
12
Modeling, analysis, simulation, scheduling, and control of semiconductor manufacturing systems: A Petri net approach
IEEE Transactions on Semiconductor Manufacturing
1998
257
13
Scheduling analysis of time-constrained dual-armed cluster tools
IEEE Transactions on Semiconductor Manufacturing
2003
243
14
A steady-state throughput analysis of cluster tools: dual-blade versus single-blade robots
IEEE Transactions on Semiconductor Manufacturing
1997
213
15
Supervisory run-to-run control of polysilicon gate etch using in situ ellipsometry
IEEE Transactions on Semiconductor Manufacturing
1994
206
16
Wafer Map Failure Pattern Recognition and Similarity Ranking for Large-Scale Data Sets
IEEE Transactions on Semiconductor Manufacturing
2015
197
17
A Petri Net Method for Schedulability and Scheduling Problems in Single-Arm Cluster Tools With Wafer Residency Time Constraints
IEEE Transactions on Semiconductor Manufacturing
2008
194
18
Modeling of chemical-mechanical polishing: a review
IEEE Transactions on Semiconductor Manufacturing
1995
191
19
A neural-network approach to recognize defect spatial pattern in semiconductor fabrication
IEEE Transactions on Semiconductor Manufacturing
2000
189
20
Analysis and decomposition of spatial variation in integrated circuit processes and devices
IEEE Transactions on Semiconductor Manufacturing
1997
185
21
Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven
IEEE Transactions on Semiconductor Manufacturing
1988
181
22
A production planning methodology for semiconductor manufacturing based on iterative simulation and linear programming calculations
IEEE Transactions on Semiconductor Manufacturing
1996
181
23
Single-wafer cluster tool performance: an analysis of throughput
IEEE Transactions on Semiconductor Manufacturing
1994
178
24
Modeling of interconnect capacitance, delay, and crosstalk in VLSI
IEEE Transactions on Semiconductor Manufacturing
2000
176
25
Advantages of plasma etch modeling using neural networks over statistical techniques
IEEE Transactions on Semiconductor Manufacturing
1993
174
26
Dynamic batching heuristic for simultaneous processing
IEEE Transactions on Semiconductor Manufacturing
1991
172
27
Convolutional Neural Network for Wafer Surface Defect Classification and the Detection of Unknown Defect Class
IEEE Transactions on Semiconductor Manufacturing
2019
172
28
Multiblock Principal Component Analysis Based on a Combined Index for Semiconductor Fault Detection and Diagnosis
IEEE Transactions on Semiconductor Manufacturing
2006
166
29
Classification of Mixed-Type Defect Patterns in Wafer Bin Maps Using Convolutional Neural Networks
IEEE Transactions on Semiconductor Manufacturing
2018
154
30
In Search of “Forever,” Continued Transistor Scaling One New Material at a Time
IEEE Transactions on Semiconductor Manufacturing
2005
151
31
Ring Oscillators for CMOS Process Tuning and Variability Control
IEEE Transactions on Semiconductor Manufacturing
2006
150
32
Effects of abrasive size distribution in chemical mechanical planarization: Modeling and verification
IEEE Transactions on Semiconductor Manufacturing
2003
143
33
Integrated circuit yield management and yield analysis: development and implementation
IEEE Transactions on Semiconductor Manufacturing
1995
142
34
Scheduling of semiconductor test facility via Petri nets and hybrid heuristic search
IEEE Transactions on Semiconductor Manufacturing
1998
139
35
Single-wafer cluster tool performance: an analysis of the effects of redundant chambers and revisitation sequences on throughput
IEEE Transactions on Semiconductor Manufacturing
1996
137
36
Tractable Nonlinear Production Planning Models for Semiconductor Wafer Fabrication Facilities
IEEE Transactions on Semiconductor Manufacturing
2006
136
37
A Voting Ensemble Classifier for Wafer Map Defect Patterns Identification in Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing
2019
134
38
Advanced Dicing Technology for Semiconductor Wafer—Stealth Dicing
IEEE Transactions on Semiconductor Manufacturing
2007
131
39
Analysis of Wafer Sojourn Time in Dual-Arm Cluster Tools With Residency Time Constraint and Activity Time Variation
IEEE Transactions on Semiconductor Manufacturing
2010
131
40
A plasticity-based model of material removal in chemical-mechanical polishing (CMP)
IEEE Transactions on Semiconductor Manufacturing
2001
129
41
Petri Net Modeling and Wafer Sojourn Time Analysis of Single-Arm Cluster Tools With Residency Time Constraints and Activity Time Variation
IEEE Transactions on Semiconductor Manufacturing
2012
129
42
Wafer Map Defect Detection and Recognition Using Joint Local and Nonlocal Linear Discriminant Analysis
IEEE Transactions on Semiconductor Manufacturing
2016
129
43
A new scheduling approach using combined dispatching criteria in wafer fabs
IEEE Transactions on Semiconductor Manufacturing
2003
127
44
Decision Tree Ensemble-Based Wafer Map Failure Pattern Recognition Based on Radon Transform-Based Features
IEEE Transactions on Semiconductor Manufacturing
2018
125
45
Specular spectroscopic scatterometry
IEEE Transactions on Semiconductor Manufacturing
2001
124
46
A Petri Net-Based Novel Scheduling Approach and Its Cycle Time Analysis for Dual-Arm Cluster Tools With Wafer Revisiting
IEEE Transactions on Semiconductor Manufacturing
2013
124
47
Multicluster Tools Scheduling: An Integrated Event Graph and Network Model Approach
IEEE Transactions on Semiconductor Manufacturing
2006
123
48
A queueing network model for semiconductor manufacturing
IEEE Transactions on Semiconductor Manufacturing
1996
121
49
Petri Net-Based Optimal One-Wafer Scheduling of Single-Arm Multi-Cluster Tools in Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing
2013
121
50
An overview of level set methods for etching, deposition, and lithography development
IEEE Transactions on Semiconductor Manufacturing
1997
119
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