17.8K(top 1%)
papers
215.8K(top 1%)
citations
114(top 2%)
h-index
171(top 2%)
g-index
117.2K
all documents
4.7K
doc citations

Top Articles

#TitleJournalYearCitations
1Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)Microelectronic Engineering19861,070
2Phase change memory technologyJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics2010818
3Carbon nanotubes in interconnect applicationsMicroelectronic Engineering2002569
4Nanofabrication by electron beam lithography and its applications: A reviewMicroelectronic Engineering2015554
5Point-of-care testing (POCT) diagnostic systems using microfluidic lab-on-a-chip technologiesMicroelectronic Engineering2015417
6PDMS-based microfluidic devices for biomedical applicationsMicroelectronic Engineering2002411
7Lab-on-a-chip devices: How to close and plug the lab?Microelectronic Engineering2015402
8Towards implementation of a nickel silicide process for CMOS technologiesMicroelectronic Engineering2003391
9Optimization of poly-di-methyl-siloxane (PDMS) substrates for studying cellular adhesion and motilityMicroelectronic Engineering2008373
10Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devicesMicroelectronic Engineering2018360
11Imprint lithography with sub-10 nm feature size and high throughputMicroelectronic Engineering1997355
12Flow behaviour of thin polymer films used for hot embossing lithographyMicroelectronic Engineering2000347
13Ultrathin high-K metal oxides on silicon: processing, characterization and integration issuesMicroelectronic Engineering2001347
14Formation of more stable hydrophilic surfaces of PDMS by plasma and chemical treatmentsMicroelectronic Engineering2006339
15On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistorsMicroelectronic Engineering2006337
16Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devicesMicroelectronic Engineering2007328
17Novel hydrogen gas sensor based on single ZnO nanorodMicroelectronic Engineering2008327
18Measurement of nonlinear mechanical properties of PDMS elastomerMicroelectronic Engineering2011321
19Access devices for 3D crosspoint memoryJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics2014285
20NiSi salicide technology for scaled CMOSMicroelectronic Engineering2002284
21Ultrathin HfO2 films grown on silicon by atomic layer deposition for advanced gate dielectrics applicationsMicroelectronic Engineering2003281
22Direct laser writing: Principles and materials for scaffold 3D printingMicroelectronic Engineering2015281
23Gold cleaning methods for electrochemical detection applicationsMicroelectronic Engineering2009267
24Hierarchical roughness makes superhydrophobic states stableMicroelectronic Engineering2007263
25Brain-inspired computing with resistive switching memory (RRAM): Devices, synapses and neural networksMicroelectronic Engineering2018258
26Improving stamps for 10 nm level wafer scale nanoimprint lithographyMicroelectronic Engineering2002251
27A comparative study of Pd/Sn/Au, Au/Ge/Au/Ni/Au, Au-Ge/Ni and Ni/Au-Ge/Ni ohmic contacts to n-GaAsMicroelectronic Engineering1998250
28Roadmap for 22nm and beyond (Invited Paper)Microelectronic Engineering2009248
29Beyond the lateral flow assay: A review of paper-based microfluidicsMicroelectronic Engineering2019245
30Fabrication and characterization of heterostructures with subnanometer thicknessMicroelectronic Engineering1984232
31High-k dielectrics for future generation memory devices (Invited Paper)Microelectronic Engineering2009223
32Development of a flexible PDMS capacitive pressure sensor for plantar pressure measurementMicroelectronic Engineering2012218
33Multi-gate SOI MOSFETsMicroelectronic Engineering2007217
34An overview of through-silicon-via technology and manufacturing challengesMicroelectronic Engineering2015212
35PVDF‐based dielectric polymers and their applications in electronic materialsIET Nanodielectrics2018211
36Fabrication of diffraction gratings for hard X-ray phase contrast imagingMicroelectronic Engineering2007206
37Graphene and carbon nanotube (CNT) in MEMS/NEMS applicationsMicroelectronic Engineering2015206
38Superhydrophobic surfaces fabricated by nanoimprint lithographyMicroelectronic Engineering2006205
39Design and dynamics of a 3-DOF flexure-based parallel mechanism for micro/nano manipulationMicroelectronic Engineering2010197
40A contribution to the flow behaviour of thin polymer films during hot embossing lithographyMicroelectronic Engineering2001196
41Influence of the electron mean free path on the resistivity of thin metal filmsMicroelectronic Engineering2004195
42Hierarchical micro and nano structured, hydrophilic, superhydrophobic and superoleophobic surfaces incorporated in microfluidics, microarrays and lab on chip microsystemsMicroelectronic Engineering2015192
43Pattern transfer: Self-assembled monolayers as ultrathin resistsMicroelectronic Engineering1996191
44Challenges, developments and applications of silicon deep reactive ion etchingMicroelectronic Engineering2003190
45Electron beam lithography—Resolution limitsMicroelectronic Engineering1996189
46Micropumps and biomedical applications – A reviewMicroelectronic Engineering2018189
47An overview of supercritical CO2 applications in microelectronics processingMicroelectronic Engineering2003182
48One-step 3D shaping using a gray-tone mask for optical and microelectronic applicationsMicroelectronic Engineering1994180
49Ultrahigh density, high-data-rate NEMS-based AFM data storage systemMicroelectronic Engineering1999179
50Helium ion microscopyJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics2014177
51Temperature and frequency dependent electrical and dielectric properties of Al/SiO2/p-Si (MOS) structureMicroelectronic Engineering2005176
52Dielectric spectroscopy studies on (PVP+PVA) polyblend filmMicroelectronic Engineering2006174
533D printed microfluidics and microelectronicsMicroelectronic Engineering2018172
54High-temperature lead-free solder alternativesMicroelectronic Engineering2011171
55Sub-50 nm period patterns with EUV interference lithographyMicroelectronic Engineering2003170
56Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabricationJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics2011169
57Microlens array produced using hot embossing processMicroelectronic Engineering2002168
58Replication techniques for diffractive optical elementsMicroelectronic Engineering1997167
59Mechanical characterization of a new high-aspect-ratio near UV-photoresistMicroelectronic Engineering1998165
60Micromechanics: A toolbox for femtoscale science: “Towards a laboratory on a tip”Microelectronic Engineering1997161
61Non-destructive characterisation of porous low-k dielectric filmsMicroelectronic Engineering2002158
62Current status and challenges of ferroelectric memory devicesMicroelectronic Engineering2005156
63Fabrication technologies for microsystems utilizing photoetchable glassMicroelectronic Engineering1996155
64Nanoreplication in polymers using hot embossing and injection moldingMicroelectronic Engineering2000154
65Full potential investigations of structural and electronic properties of ZrSiO4Microelectronic Engineering2005153
66Atomic layer deposition of titanium nitride from TDMAT precursorMicroelectronic Engineering2009153
67Dielectric materials for high‐temperature capacitorsIET Nanodielectrics2018152
68Microfluidic platforms for cell cultures and investigationsMicroelectronic Engineering2019152
69Porous silicon: The material and its applications to SOI technologiesMicroelectronic Engineering1988150
70Fabrication and electrical characteristics of Schottky diode based on organic materialMicroelectronic Engineering2008147
71Future challenges of flash memory technologiesMicroelectronic Engineering2009147
72Nano-patterning of a hydrogen silsesquioxane resist with reduced linewidth fluctuationsMicroelectronic Engineering1998146
73Reactive sputter deposition and properties of TaxN thin filmsMicroelectronic Engineering2002146
74An industrial and applied review of new MEMS devices featuresMicroelectronic Engineering2007146
7530 years of electroless plating for semiconductor and polymer micro-systemsMicroelectronic Engineering2015145
76Self-annealing characterization of electroplated copper filmsMicroelectronic Engineering2000144
77Resistless patterning of sub-micron structures by evaporation through nanostencilsMicroelectronic Engineering2000143
78Effect of alloying elements on properties and microstructures of SnAgCu soldersMicroelectronic Engineering2010143
79Microfabricated textured surfaces for super-hydrophobicity investigationsMicroelectronic Engineering2005142
80Review Article: FePt heat assisted magnetic recording mediaJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics2016142
81Evaporating characteristics of sessile droplet on hydrophobic and hydrophilic surfacesMicroelectronic Engineering2009140
82All-inkjet-printed electrical components and circuit fabrication on a plastic substrateMicroelectronic Engineering2012140
83Defect detection on semiconductor wafer surfacesMicroelectronic Engineering2005139
84Phase change materials and their application to random access memory technologyMicroelectronic Engineering2008139
85Opportunities and challenges for Ge CMOS – Control of interfacing field on Ge is a key (Invited Paper)Microelectronic Engineering2009137
86Two-dimensional MOSFET simulation by means of a multidimensional spherical harmonics expansion of the Boltzmann transport equationMicroelectronic Engineering1992136
87Effects of temperature on the optical and electrical properties of ZnO nanoparticles synthesized by sol–gel methodMicroelectronic Engineering2014136
88Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) materialMicroelectronic Engineering1997135
89Fabrication of PDMS (polydimethylsiloxane) microlens and diffuser using replica moldingMicroelectronic Engineering2006132
90Effect of synthesis conditions on the properties of citric-acid coated iron oxide nanoparticlesMicroelectronic Engineering2013131
91Focused electron beam induced deposition meets materials scienceMicroelectronic Engineering2018131
92Microelectromechanical systems based on ferroelectric thin filmsMicroelectronic Engineering1995130
93Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmasMicroelectronic Engineering2005130
94UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturingMicroelectronic Engineering2010129
95Electrical behavior of β-Ga2O3 Schottky diodes with different Schottky metalsJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics2017129
96Basic mechanisms involved in the Smart-Cut® processMicroelectronic Engineering1997128
97BSM 7: RIE lag in high aspect ratio trench etching of siliconMicroelectronic Engineering1997125
98Structural and electrical characterisation of titanium and nickel silicide contacts on silicon carbideMicroelectronic Engineering2002125
99Resistive non-volatile memory devices (Invited Paper)Microelectronic Engineering2009125
100Through silicon via: From the CMOS imager sensor wafer level package to the 3D integrationMicroelectronic Engineering2010125