| # | Title | Journal | Year | Citations |
|---|
|
| 1 | Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process) | Microelectronic Engineering | 1986 | 1,070 |
| 2 | Phase change memory technology | Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | 2010 | 818 |
| 3 | Carbon nanotubes in interconnect applications | Microelectronic Engineering | 2002 | 569 |
| 4 | Nanofabrication by electron beam lithography and its applications: A review | Microelectronic Engineering | 2015 | 554 |
| 5 | Point-of-care testing (POCT) diagnostic systems using microfluidic lab-on-a-chip technologies | Microelectronic Engineering | 2015 | 417 |
| 6 | PDMS-based microfluidic devices for biomedical applications | Microelectronic Engineering | 2002 | 411 |
| 7 | Lab-on-a-chip devices: How to close and plug the lab? | Microelectronic Engineering | 2015 | 402 |
| 8 | Towards implementation of a nickel silicide process for CMOS technologies | Microelectronic Engineering | 2003 | 391 |
| 9 | Optimization of poly-di-methyl-siloxane (PDMS) substrates for studying cellular adhesion and motility | Microelectronic Engineering | 2008 | 373 |
| 10 | Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices | Microelectronic Engineering | 2018 | 360 |
| 11 | Imprint lithography with sub-10 nm feature size and high throughput | Microelectronic Engineering | 1997 | 355 |
| 12 | Flow behaviour of thin polymer films used for hot embossing lithography | Microelectronic Engineering | 2000 | 347 |
| 13 | Ultrathin high-K metal oxides on silicon: processing, characterization and integration issues | Microelectronic Engineering | 2001 | 347 |
| 14 | Formation of more stable hydrophilic surfaces of PDMS by plasma and chemical treatments | Microelectronic Engineering | 2006 | 339 |
| 15 | On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors | Microelectronic Engineering | 2006 | 337 |
| 16 | Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices | Microelectronic Engineering | 2007 | 328 |
| 17 | Novel hydrogen gas sensor based on single ZnO nanorod | Microelectronic Engineering | 2008 | 327 |
| 18 | Measurement of nonlinear mechanical properties of PDMS elastomer | Microelectronic Engineering | 2011 | 321 |
| 19 | Access devices for 3D crosspoint memory | Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | 2014 | 285 |
| 20 | NiSi salicide technology for scaled CMOS | Microelectronic Engineering | 2002 | 284 |
| 21 | Ultrathin HfO2 films grown on silicon by atomic layer deposition for advanced gate dielectrics applications | Microelectronic Engineering | 2003 | 281 |
| 22 | Direct laser writing: Principles and materials for scaffold 3D printing | Microelectronic Engineering | 2015 | 281 |
| 23 | Gold cleaning methods for electrochemical detection applications | Microelectronic Engineering | 2009 | 267 |
| 24 | Hierarchical roughness makes superhydrophobic states stable | Microelectronic Engineering | 2007 | 263 |
| 25 | Brain-inspired computing with resistive switching memory (RRAM): Devices, synapses and neural networks | Microelectronic Engineering | 2018 | 258 |
| 26 | Improving stamps for 10 nm level wafer scale nanoimprint lithography | Microelectronic Engineering | 2002 | 251 |
| 27 | A comparative study of Pd/Sn/Au, Au/Ge/Au/Ni/Au, Au-Ge/Ni and Ni/Au-Ge/Ni ohmic contacts to n-GaAs | Microelectronic Engineering | 1998 | 250 |
| 28 | Roadmap for 22nm and beyond (Invited Paper) | Microelectronic Engineering | 2009 | 248 |
| 29 | Beyond the lateral flow assay: A review of paper-based microfluidics | Microelectronic Engineering | 2019 | 245 |
| 30 | Fabrication and characterization of heterostructures with subnanometer thickness | Microelectronic Engineering | 1984 | 232 |
| 31 | High-k dielectrics for future generation memory devices (Invited Paper) | Microelectronic Engineering | 2009 | 223 |
| 32 | Development of a flexible PDMS capacitive pressure sensor for plantar pressure measurement | Microelectronic Engineering | 2012 | 218 |
| 33 | Multi-gate SOI MOSFETs | Microelectronic Engineering | 2007 | 217 |
| 34 | An overview of through-silicon-via technology and manufacturing challenges | Microelectronic Engineering | 2015 | 212 |
| 35 | PVDF‐based dielectric polymers and their applications in electronic materials | IET Nanodielectrics | 2018 | 211 |
| 36 | Fabrication of diffraction gratings for hard X-ray phase contrast imaging | Microelectronic Engineering | 2007 | 206 |
| 37 | Graphene and carbon nanotube (CNT) in MEMS/NEMS applications | Microelectronic Engineering | 2015 | 206 |
| 38 | Superhydrophobic surfaces fabricated by nanoimprint lithography | Microelectronic Engineering | 2006 | 205 |
| 39 | Design and dynamics of a 3-DOF flexure-based parallel mechanism for micro/nano manipulation | Microelectronic Engineering | 2010 | 197 |
| 40 | A contribution to the flow behaviour of thin polymer films during hot embossing lithography | Microelectronic Engineering | 2001 | 196 |
| 41 | Influence of the electron mean free path on the resistivity of thin metal films | Microelectronic Engineering | 2004 | 195 |
| 42 | Hierarchical micro and nano structured, hydrophilic, superhydrophobic and superoleophobic surfaces incorporated in microfluidics, microarrays and lab on chip microsystems | Microelectronic Engineering | 2015 | 192 |
| 43 | Pattern transfer: Self-assembled monolayers as ultrathin resists | Microelectronic Engineering | 1996 | 191 |
| 44 | Challenges, developments and applications of silicon deep reactive ion etching | Microelectronic Engineering | 2003 | 190 |
| 45 | Electron beam lithography—Resolution limits | Microelectronic Engineering | 1996 | 189 |
| 46 | Micropumps and biomedical applications – A review | Microelectronic Engineering | 2018 | 189 |
| 47 | An overview of supercritical CO2 applications in microelectronics processing | Microelectronic Engineering | 2003 | 182 |
| 48 | One-step 3D shaping using a gray-tone mask for optical and microelectronic applications | Microelectronic Engineering | 1994 | 180 |
| 49 | Ultrahigh density, high-data-rate NEMS-based AFM data storage system | Microelectronic Engineering | 1999 | 179 |
| 50 | Helium ion microscopy | Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | 2014 | 177 |
| 51 | Temperature and frequency dependent electrical and dielectric properties of Al/SiO2/p-Si (MOS) structure | Microelectronic Engineering | 2005 | 176 |
| 52 | Dielectric spectroscopy studies on (PVP+PVA) polyblend film | Microelectronic Engineering | 2006 | 174 |
| 53 | 3D printed microfluidics and microelectronics | Microelectronic Engineering | 2018 | 172 |
| 54 | High-temperature lead-free solder alternatives | Microelectronic Engineering | 2011 | 171 |
| 55 | Sub-50 nm period patterns with EUV interference lithography | Microelectronic Engineering | 2003 | 170 |
| 56 | Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabrication | Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | 2011 | 169 |
| 57 | Microlens array produced using hot embossing process | Microelectronic Engineering | 2002 | 168 |
| 58 | Replication techniques for diffractive optical elements | Microelectronic Engineering | 1997 | 167 |
| 59 | Mechanical characterization of a new high-aspect-ratio near UV-photoresist | Microelectronic Engineering | 1998 | 165 |
| 60 | Micromechanics: A toolbox for femtoscale science: “Towards a laboratory on a tip” | Microelectronic Engineering | 1997 | 161 |
| 61 | Non-destructive characterisation of porous low-k dielectric films | Microelectronic Engineering | 2002 | 158 |
| 62 | Current status and challenges of ferroelectric memory devices | Microelectronic Engineering | 2005 | 156 |
| 63 | Fabrication technologies for microsystems utilizing photoetchable glass | Microelectronic Engineering | 1996 | 155 |
| 64 | Nanoreplication in polymers using hot embossing and injection molding | Microelectronic Engineering | 2000 | 154 |
| 65 | Full potential investigations of structural and electronic properties of ZrSiO4 | Microelectronic Engineering | 2005 | 153 |
| 66 | Atomic layer deposition of titanium nitride from TDMAT precursor | Microelectronic Engineering | 2009 | 153 |
| 67 | Dielectric materials for high‐temperature capacitors | IET Nanodielectrics | 2018 | 152 |
| 68 | Microfluidic platforms for cell cultures and investigations | Microelectronic Engineering | 2019 | 152 |
| 69 | Porous silicon: The material and its applications to SOI technologies | Microelectronic Engineering | 1988 | 150 |
| 70 | Fabrication and electrical characteristics of Schottky diode based on organic material | Microelectronic Engineering | 2008 | 147 |
| 71 | Future challenges of flash memory technologies | Microelectronic Engineering | 2009 | 147 |
| 72 | Nano-patterning of a hydrogen silsesquioxane resist with reduced linewidth fluctuations | Microelectronic Engineering | 1998 | 146 |
| 73 | Reactive sputter deposition and properties of TaxN thin films | Microelectronic Engineering | 2002 | 146 |
| 74 | An industrial and applied review of new MEMS devices features | Microelectronic Engineering | 2007 | 146 |
| 75 | 30 years of electroless plating for semiconductor and polymer micro-systems | Microelectronic Engineering | 2015 | 145 |
| 76 | Self-annealing characterization of electroplated copper films | Microelectronic Engineering | 2000 | 144 |
| 77 | Resistless patterning of sub-micron structures by evaporation through nanostencils | Microelectronic Engineering | 2000 | 143 |
| 78 | Effect of alloying elements on properties and microstructures of SnAgCu solders | Microelectronic Engineering | 2010 | 143 |
| 79 | Microfabricated textured surfaces for super-hydrophobicity investigations | Microelectronic Engineering | 2005 | 142 |
| 80 | Review Article: FePt heat assisted magnetic recording media | Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | 2016 | 142 |
| 81 | Evaporating characteristics of sessile droplet on hydrophobic and hydrophilic surfaces | Microelectronic Engineering | 2009 | 140 |
| 82 | All-inkjet-printed electrical components and circuit fabrication on a plastic substrate | Microelectronic Engineering | 2012 | 140 |
| 83 | Defect detection on semiconductor wafer surfaces | Microelectronic Engineering | 2005 | 139 |
| 84 | Phase change materials and their application to random access memory technology | Microelectronic Engineering | 2008 | 139 |
| 85 | Opportunities and challenges for Ge CMOS – Control of interfacing field on Ge is a key (Invited Paper) | Microelectronic Engineering | 2009 | 137 |
| 86 | Two-dimensional MOSFET simulation by means of a multidimensional spherical harmonics expansion of the Boltzmann transport equation | Microelectronic Engineering | 1992 | 136 |
| 87 | Effects of temperature on the optical and electrical properties of ZnO nanoparticles synthesized by sol–gel method | Microelectronic Engineering | 2014 | 136 |
| 88 | Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material | Microelectronic Engineering | 1997 | 135 |
| 89 | Fabrication of PDMS (polydimethylsiloxane) microlens and diffuser using replica molding | Microelectronic Engineering | 2006 | 132 |
| 90 | Effect of synthesis conditions on the properties of citric-acid coated iron oxide nanoparticles | Microelectronic Engineering | 2013 | 131 |
| 91 | Focused electron beam induced deposition meets materials science | Microelectronic Engineering | 2018 | 131 |
| 92 | Microelectromechanical systems based on ferroelectric thin films | Microelectronic Engineering | 1995 | 130 |
| 93 | Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmas | Microelectronic Engineering | 2005 | 130 |
| 94 | UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing | Microelectronic Engineering | 2010 | 129 |
| 95 | Electrical behavior of β-Ga2O3 Schottky diodes with different Schottky metals | Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics | 2017 | 129 |
| 96 | Basic mechanisms involved in the Smart-Cut® process | Microelectronic Engineering | 1997 | 128 |
| 97 | BSM 7: RIE lag in high aspect ratio trench etching of silicon | Microelectronic Engineering | 1997 | 125 |
| 98 | Structural and electrical characterisation of titanium and nickel silicide contacts on silicon carbide | Microelectronic Engineering | 2002 | 125 |
| 99 | Resistive non-volatile memory devices (Invited Paper) | Microelectronic Engineering | 2009 | 125 |
| 100 | Through silicon via: From the CMOS imager sensor wafer level package to the 3D integration | Microelectronic Engineering | 2010 | 125 |
