# | Title | Journal | Year | Citations |
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1 | Effect of Synthesis on Quality, Electronic Properties and Environmental Stability of Individual Monolayer Ti3C2 MXene Flakes | Advanced Electronic Materials | 2016 | 1,160 |
2 | Ultrawide‐Bandgap Semiconductors: Research Opportunities and Challenges | Advanced Electronic Materials | 2018 | 839 |
3 | Effective Approaches to Improve the Electrical Conductivity of PEDOT:PSS: A Review | Advanced Electronic Materials | 2015 | 821 |
4 | Estimation of the thermal band gap of a semiconductor from seebeck measurements | Journal of Electronic Materials | 1999 | 684 |
5 | Fabrication of Ti3C2Tx MXene Transparent Thin Films with Tunable Optoelectronic Properties | Advanced Electronic Materials | 2016 | 587 |
6 | Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys | Journal of Electronic Materials | 2000 | 504 |
7 | Recommended Methods to Study Resistive Switching Devices | Advanced Electronic Materials | 2019 | 452 |
8 | The Thermoelectric Properties of Bismuth Telluride | Advanced Electronic Materials | 2019 | 446 |
9 | Highly Stretchy Black Gold E‐Skin Nanopatches as Highly Sensitive Wearable Biomedical Sensors | Advanced Electronic Materials | 2015 | 405 |
10 | Photoelectrochemical Hydrogen Production | Kluwer International Series in Electronic Materials: Science and Technology | 2012 | 383 |
11 | High Thermoelectric Performance of Dually Doped ZnO Ceramics | Journal of Electronic Materials | 2009 | 370 |
12 | Flexible Electronics | Kluwer International Series in Electronic Materials: Science and Technology | 2009 | 368 |
13 | Advanced Materials for Printed Wearable Electrochemical Devices: A Review | Advanced Electronic Materials | 2017 | 358 |
14 | Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process | Journal of Electronic Materials | 2015 | 347 |
15 | Thermal behavior of silver nanoparticles for low-temperature interconnect applications | Journal of Electronic Materials | 2005 | 344 |
16 | Carbon nanotubes: Sensor properties. A review | Modern Electronic Materials | 2016 | 343 |
17 | A study of deep levels in GaAs by capacitance spectroscopy | Journal of Electronic Materials | 1975 | 339 |
18 | Ultraviolet detectors based on epitaxial ZnO films grown by MOCVD | Journal of Electronic Materials | 2000 | 338 |
19 | Asymmetric Flexible MXene‐Reduced Graphene Oxide Micro‐Supercapacitor | Advanced Electronic Materials | 2018 | 324 |
20 | Energy‐Efficient Hybrid Perovskite Memristors and Synaptic Devices | Advanced Electronic Materials | 2016 | 323 |
21 | PVDF‐Based Ferroelectric Polymers in Modern Flexible Electronics | Advanced Electronic Materials | 2017 | 321 |
22 | Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review | Journal of Electronic Materials | 1994 | 319 |
23 | Transparent Electrodes for Efficient Optoelectronics | Advanced Electronic Materials | 2017 | 310 |
24 | Lead (Pb)-free solders for electronic packaging | Journal of Electronic Materials | 1994 | 306 |
25 | Automotive Applications of Thermoelectric Materials | Journal of Electronic Materials | 2009 | 305 |
26 | Nanostructured thermoelectric materials | Journal of Electronic Materials | 2005 | 301 |
27 | Structural Changes Underlying Field‐Cycling Phenomena in Ferroelectric HfO2 Thin Films | Advanced Electronic Materials | 2016 | 301 |
28 | Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni | Journal of Electronic Materials | 2002 | 298 |
29 | Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection | Journal of Electronic Materials | 2007 | 297 |
30 | Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control | Journal of Electronic Materials | 1998 | 292 |
31 | Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders | Journal of Electronic Materials | 1997 | 289 |
32 | GaN Technology for Power Electronic Applications: A Review | Journal of Electronic Materials | 2016 | 289 |
33 | Highly Stretchable and Self‐Healable MXene/Polyvinyl Alcohol Hydrogel Electrode for Wearable Capacitive Electronic Skin | Advanced Electronic Materials | 2019 | 288 |
34 | Lithium Fluoride Additives for Stable Cycling of Lithium Batteries at High Current Densities | Advanced Electronic Materials | 2016 | 284 |
35 | Characterization of eutectic Sn-Bi solder joints | Journal of Electronic Materials | 1992 | 281 |
36 | Thermoelectric quantum-dot superlattices with high ZT | Journal of Electronic Materials | 2000 | 274 |
37 | Memristors for Energy‐Efficient New Computing Paradigms | Advanced Electronic Materials | 2016 | 272 |
38 | One‐Dimensional Nanomaterials for Soft Electronics | Advanced Electronic Materials | 2017 | 271 |
39 | Synthesis and electrochemical performance of Ti3C2Tx with hydrothermal process | Electronic Materials Letters | 2016 | 270 |
40 | A Highly Sensitive Flexible Capacitive Tactile Sensor with Sparse and High‐Aspect‐Ratio Microstructures | Advanced Electronic Materials | 2018 | 265 |
41 | Highly Sensitive Pressure Sensor Based on Bioinspired Porous Structure for Real‐Time Tactile Sensing | Advanced Electronic Materials | 2016 | 264 |
42 | Microstructure evolution of eutectic Sn-Ag solder joints | Journal of Electronic Materials | 1994 | 262 |
43 | MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient Heuristic | Journal of Electronic Materials | 2008 | 261 |
44 | MXene‐Reduced Graphene Oxide Aerogel for Aqueous Zinc‐Ion Hybrid Supercapacitor with Ultralong Cycle Life | Advanced Electronic Materials | 2019 | 259 |
45 | A viable tin-lead solder substitute: Sn-Ag-Cu | Journal of Electronic Materials | 1994 | 257 |
46 | Review paper: Transparent amorphous oxide semiconductor thin film transistor | Electronic Materials Letters | 2011 | 253 |
47 | Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging? | Journal of Electronic Materials | 2014 | 249 |
48 | Wide-gap semiconductor InGaN and InGaAln grown by MOVPE | Journal of Electronic Materials | 1992 | 246 |
49 | Recent Advances in Stretchable and Transparent Electronic Materials | Advanced Electronic Materials | 2016 | 245 |
50 | Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics | Journal of Electronic Materials | 2011 | 243 |
51 | Thermoelectric Properties of PEDOT:PSS | Advanced Electronic Materials | 2019 | 243 |
52 | Capillary instabilities in thin films | Journal of Electronic Materials | 1990 | 238 |
53 | Recent Progress in Two‐Dimensional Ferroelectric Materials | Advanced Electronic Materials | 2020 | 236 |
54 | Interstitial Point Defect Scattering Contributing to High Thermoelectric Performance in SnTe | Advanced Electronic Materials | 2016 | 235 |
55 | Progress in silicon carbide semiconductor electronics technology | Journal of Electronic Materials | 1995 | 234 |
56 | Bandgap and lattice constant of GaInAsP as a function of alloy composition | Journal of Electronic Materials | 1974 | 228 |
57 | Nickel filament polymer-matrix composites with low surface impedance and high electromagnetic interference shielding effectiveness | Journal of Electronic Materials | 1997 | 227 |
58 | Flexible, Stretchable and Wearable Multifunctional Sensor Array as Artificial Electronic Skin for Static and Dynamic Strain Mapping | Advanced Electronic Materials | 2015 | 226 |
59 | Improved oxidation procedures for reduced SiO2/SiC defects | Journal of Electronic Materials | 1996 | 224 |
60 | Excited state polarization, bulk photovoltaic effect and the photorefractive effect in electrically polarized media | Journal of Electronic Materials | 1975 | 212 |
61 | In search of new lead-free electronic solders | Journal of Electronic Materials | 1994 | 210 |
62 | High thermoelectric figures of merit in PbTe quantum wells | Journal of Electronic Materials | 1996 | 210 |
63 | Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging | Journal of Electronic Materials | 1999 | 210 |
64 | Highly Efficient Laser Scribed Graphene Electrodes for On‐Chip Electrochemical Sensing Applications | Advanced Electronic Materials | 2016 | 202 |
65 | High-Temperature Capacitor Polymer Films | Journal of Electronic Materials | 2014 | 200 |
66 | Electron mobility in two-dimensional electron gas in AIGaN/GaN heterostructures and in bulk GaN | Journal of Electronic Materials | 1996 | 197 |
67 | Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions | Journal of Electronic Materials | 1998 | 197 |
68 | Challenges for Nanoscale MOSFETs and Emerging Nanoelectronics | Transactions on Electrical and Electronic Materials | 2010 | 197 |
69 | Recent Developments in 2D Nanomaterials for Chemiresistive-Type Gas Sensors | Electronic Materials Letters | 2018 | 197 |
70 | Chemical oxidative polymerization as a synthetic route to electrically conducting polypyrroles | Journal of Electronic Materials | 1986 | 195 |
71 | Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability | Journal of Electronic Materials | 2001 | 195 |
72 | Giant Electric Energy Density in Epitaxial Lead‐Free Thin Films with Coexistence of Ferroelectrics and Antiferroelectrics | Advanced Electronic Materials | 2015 | 195 |
73 | Electrochromic Metal Oxides: Recent Progress and Prospect | Advanced Electronic Materials | 2018 | 195 |
74 | MBE growth and properties of ZnO on sapphire and SiC substrates | Journal of Electronic Materials | 1996 | 192 |
75 | Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applications | Journal of Electronic Materials | 2005 | 192 |
76 | Preparation of atomically flat surfaces on silicon carbide using hydrogen etching | Journal of Electronic Materials | 1998 | 188 |
77 | Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic Devices | Journal of Electronic Materials | 2016 | 184 |
78 | Near-Unity Photoluminescence Quantum Yield in Blue-Emitting Cs3Cu2Br5–xIx (0 ≤ x ≤ 5) | ACS Applied Electronic Materials | 2019 | 184 |
79 | Synthesis and characterization of Fe-doped ZnO thin films deposited by chemical spray pyrolysis | Modern Electronic Materials | 2017 | 183 |
80 | Dual‐Functional Graphene Composites for Electromagnetic Shielding and Thermal Management | Advanced Electronic Materials | 2019 | 183 |
81 | Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings | Journal of Electronic Materials | 1994 | 182 |
82 | Organic Biomimicking Memristor for Information Storage and Processing Applications | Advanced Electronic Materials | 2016 | 181 |
83 | Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate | Journal of Electronic Materials | 2000 | 180 |
84 | Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder | Journal of Electronic Materials | 2003 | 180 |
85 | Wearable Thermoelectric Generators for Body-Powered Devices | Journal of Electronic Materials | 2009 | 180 |
86 | “Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance? | Journal of Electronic Materials | 2010 | 179 |
87 | Origin of High Electronic Quality in Structurally Disordered CH3NH3PbI3 and the Passivation Effect of Cl and O at Grain Boundaries | Advanced Electronic Materials | 2015 | 175 |
88 | Graphene and Related Materials for Resistive Random Access Memories | Advanced Electronic Materials | 2017 | 175 |
89 | Metal contacts to n-type GaN | Journal of Electronic Materials | 1998 | 172 |
90 | On the Sn-Bi-Ag ternary phase diagram | Journal of Electronic Materials | 1994 | 171 |
91 | Stretchable Polymer Semiconductors for Plastic Electronics | Advanced Electronic Materials | 2018 | 168 |
92 | Overview of fatigue performance of Cu processed by severe plastic deformation | Journal of Electronic Materials | 1999 | 167 |
93 | Nanoionics‐Enabled Memristive Devices: Strategies and Materials for Neuromorphic Applications | Advanced Electronic Materials | 2017 | 167 |
94 | Metallic Nanoparticle Inks for 3D Printing of Electronics | Advanced Electronic Materials | 2019 | 166 |
95 | Bonding and thermal stability of implanted hydrogen in silicon | Journal of Electronic Materials | 1975 | 165 |
96 | Review paper: Recent developments in light extraction technologies of organic light emitting diodes | Electronic Materials Letters | 2011 | 162 |
97 | MXene–Silicon Van Der Waals Heterostructures for High‐Speed Self‐Driven Photodetectors | Advanced Electronic Materials | 2017 | 162 |
98 | Spinodal decomposition and clustering in III/V alloys | Journal of Electronic Materials | 1982 | 161 |
99 | Characterization and optimization of the SiO2/SiC metal-oxide semiconductor interface | Journal of Electronic Materials | 1995 | 160 |
100 | Real-time stress evolution during Si1-xGex Heteroepitaxy: Dislocations, islanding, and segregation | Journal of Electronic Materials | 1997 | 160 |