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#TitleJournalYearCitations
1Effect of Synthesis on Quality, Electronic Properties and Environmental Stability of Individual Monolayer Ti3C2 MXene FlakesAdvanced Electronic Materials20161,160
2Ultrawide‐Bandgap Semiconductors: Research Opportunities and ChallengesAdvanced Electronic Materials2018839
3Effective Approaches to Improve the Electrical Conductivity of PEDOT:PSS: A ReviewAdvanced Electronic Materials2015821
4Estimation of the thermal band gap of a semiconductor from seebeck measurementsJournal of Electronic Materials1999684
5Fabrication of Ti3C2Tx MXene Transparent Thin Films with Tunable Optoelectronic PropertiesAdvanced Electronic Materials2016587
6Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloysJournal of Electronic Materials2000504
7Recommended Methods to Study Resistive Switching DevicesAdvanced Electronic Materials2019452
8The Thermoelectric Properties of Bismuth TellurideAdvanced Electronic Materials2019446
9Highly Stretchy Black Gold E‐Skin Nanopatches as Highly Sensitive Wearable Biomedical SensorsAdvanced Electronic Materials2015405
10Photoelectrochemical Hydrogen ProductionKluwer International Series in Electronic Materials: Science and Technology2012383
11High Thermoelectric Performance of Dually Doped ZnO CeramicsJournal of Electronic Materials2009370
12Flexible ElectronicsKluwer International Series in Electronic Materials: Science and Technology2009368
13Advanced Materials for Printed Wearable Electrochemical Devices: A ReviewAdvanced Electronic Materials2017358
14Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing ProcessJournal of Electronic Materials2015347
15Thermal behavior of silver nanoparticles for low-temperature interconnect applicationsJournal of Electronic Materials2005344
16Carbon nanotubes: Sensor properties. A reviewModern Electronic Materials2016343
17A study of deep levels in GaAs by capacitance spectroscopyJournal of Electronic Materials1975339
18Ultraviolet detectors based on epitaxial ZnO films grown by MOCVDJournal of Electronic Materials2000338
19Asymmetric Flexible MXene‐Reduced Graphene Oxide Micro‐SupercapacitorAdvanced Electronic Materials2018324
20Energy‐Efficient Hybrid Perovskite Memristors and Synaptic DevicesAdvanced Electronic Materials2016323
21PVDF‐Based Ferroelectric Polymers in Modern Flexible ElectronicsAdvanced Electronic Materials2017321
22Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials1994319
23Transparent Electrodes for Efficient OptoelectronicsAdvanced Electronic Materials2017310
24Lead (Pb)-free solders for electronic packagingJournal of Electronic Materials1994306
25Automotive Applications of Thermoelectric MaterialsJournal of Electronic Materials2009305
26Nanostructured thermoelectric materialsJournal of Electronic Materials2005301
27Structural Changes Underlying Field‐Cycling Phenomena in Ferroelectric HfO2 Thin FilmsAdvanced Electronic Materials2016301
28Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and NiJournal of Electronic Materials2002298
29Low-Temperature Sintering with Nano-Silver Paste in Die-Attached InterconnectionJournal of Electronic Materials2007297
30Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion controlJournal of Electronic Materials1998292
31Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic soldersJournal of Electronic Materials1997289
32GaN Technology for Power Electronic Applications: A ReviewJournal of Electronic Materials2016289
33Highly Stretchable and Self‐Healable MXene/Polyvinyl Alcohol Hydrogel Electrode for Wearable Capacitive Electronic SkinAdvanced Electronic Materials2019288
34Lithium Fluoride Additives for Stable Cycling of Lithium Batteries at High Current DensitiesAdvanced Electronic Materials2016284
35Characterization of eutectic Sn-Bi solder jointsJournal of Electronic Materials1992281
36Thermoelectric quantum-dot superlattices with high ZTJournal of Electronic Materials2000274
37Memristors for Energy‐Efficient New Computing ParadigmsAdvanced Electronic Materials2016272
38One‐Dimensional Nanomaterials for Soft ElectronicsAdvanced Electronic Materials2017271
39Synthesis and electrochemical performance of Ti3C2Tx with hydrothermal processElectronic Materials Letters2016270
40A Highly Sensitive Flexible Capacitive Tactile Sensor with Sparse and High‐Aspect‐Ratio MicrostructuresAdvanced Electronic Materials2018265
41Highly Sensitive Pressure Sensor Based on Bioinspired Porous Structure for Real‐Time Tactile SensingAdvanced Electronic Materials2016264
42Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials1994262
43MBE HgCdTe Technology: A Very General Solution to IR Detection, Described by “Rule 07”, a Very Convenient HeuristicJournal of Electronic Materials2008261
44MXene‐Reduced Graphene Oxide Aerogel for Aqueous Zinc‐Ion Hybrid Supercapacitor with Ultralong Cycle LifeAdvanced Electronic Materials2019259
45A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials1994257
46Review paper: Transparent amorphous oxide semiconductor thin film transistorElectronic Materials Letters2011253
47Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?Journal of Electronic Materials2014249
48Wide-gap semiconductor InGaN and InGaAln grown by MOVPEJournal of Electronic Materials1992246
49Recent Advances in Stretchable and Transparent Electronic MaterialsAdvanced Electronic Materials2016245
50Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed ElectronicsJournal of Electronic Materials2011243
51Thermoelectric Properties of PEDOT:PSSAdvanced Electronic Materials2019243
52Capillary instabilities in thin filmsJournal of Electronic Materials1990238
53Recent Progress in Two‐Dimensional Ferroelectric MaterialsAdvanced Electronic Materials2020236
54Interstitial Point Defect Scattering Contributing to High Thermoelectric Performance in SnTeAdvanced Electronic Materials2016235
55Progress in silicon carbide semiconductor electronics technologyJournal of Electronic Materials1995234
56Bandgap and lattice constant of GaInAsP as a function of alloy compositionJournal of Electronic Materials1974228
57Nickel filament polymer-matrix composites with low surface impedance and high electromagnetic interference shielding effectivenessJournal of Electronic Materials1997227
58Flexible, Stretchable and Wearable Multifunctional Sensor Array as Artificial Electronic Skin for Static and Dynamic Strain MappingAdvanced Electronic Materials2015226
59Improved oxidation procedures for reduced SiO2/SiC defectsJournal of Electronic Materials1996224
60Excited state polarization, bulk photovoltaic effect and the photorefractive effect in electrically polarized mediaJournal of Electronic Materials1975212
61In search of new lead-free electronic soldersJournal of Electronic Materials1994210
62High thermoelectric figures of merit in PbTe quantum wellsJournal of Electronic Materials1996210
63Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term agingJournal of Electronic Materials1999210
64Highly Efficient Laser Scribed Graphene Electrodes for On‐Chip Electrochemical Sensing ApplicationsAdvanced Electronic Materials2016202
65High-Temperature Capacitor Polymer FilmsJournal of Electronic Materials2014200
66Electron mobility in two-dimensional electron gas in AIGaN/GaN heterostructures and in bulk GaNJournal of Electronic Materials1996197
67Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactionsJournal of Electronic Materials1998197
68Challenges for Nanoscale MOSFETs and Emerging NanoelectronicsTransactions on Electrical and Electronic Materials2010197
69Recent Developments in 2D Nanomaterials for Chemiresistive-Type Gas SensorsElectronic Materials Letters2018197
70Chemical oxidative polymerization as a synthetic route to electrically conducting polypyrrolesJournal of Electronic Materials1986195
71Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stabilityJournal of Electronic Materials2001195
72Giant Electric Energy Density in Epitaxial Lead‐Free Thin Films with Coexistence of Ferroelectrics and AntiferroelectricsAdvanced Electronic Materials2015195
73Electrochromic Metal Oxides: Recent Progress and ProspectAdvanced Electronic Materials2018195
74MBE growth and properties of ZnO on sapphire and SiC substratesJournal of Electronic Materials1996192
75Self-assembly of metal nanocrystals on ultrathin oxide for nonvolatile memory applicationsJournal of Electronic Materials2005192
76Preparation of atomically flat surfaces on silicon carbide using hydrogen etchingJournal of Electronic Materials1998188
77Modifying Poly(Vinyl Alcohol) (PVA) from Insulator to Small-Bandgap Polymer: A Novel Approach for Organic Solar Cells and Optoelectronic DevicesJournal of Electronic Materials2016184
78Near-Unity Photoluminescence Quantum Yield in Blue-Emitting Cs3Cu2Br5–xIx (0 ≤ x ≤ 5)ACS Applied Electronic Materials2019184
79Synthesis and characterization of Fe-doped ZnO thin films deposited by chemical spray pyrolysisModern Electronic Materials2017183
80Dual‐Functional Graphene Composites for Electromagnetic Shielding and Thermal ManagementAdvanced Electronic Materials2019183
81Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsJournal of Electronic Materials1994182
82Organic Biomimicking Memristor for Information Storage and Processing ApplicationsAdvanced Electronic Materials2016181
83Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrateJournal of Electronic Materials2000180
84Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solderJournal of Electronic Materials2003180
85Wearable Thermoelectric Generators for Body-Powered DevicesJournal of Electronic Materials2009180
86“Rule 07” Revisited: Still a Good Heuristic Predictor of p/n HgCdTe Photodiode Performance?Journal of Electronic Materials2010179
87Origin of High Electronic Quality in Structurally Disordered CH3NH3PbI3 and the Passivation Effect of Cl and O at Grain BoundariesAdvanced Electronic Materials2015175
88Graphene and Related Materials for Resistive Random Access MemoriesAdvanced Electronic Materials2017175
89Metal contacts to n-type GaNJournal of Electronic Materials1998172
90On the Sn-Bi-Ag ternary phase diagramJournal of Electronic Materials1994171
91Stretchable Polymer Semiconductors for Plastic ElectronicsAdvanced Electronic Materials2018168
92Overview of fatigue performance of Cu processed by severe plastic deformationJournal of Electronic Materials1999167
93Nanoionics‐Enabled Memristive Devices: Strategies and Materials for Neuromorphic ApplicationsAdvanced Electronic Materials2017167
94Metallic Nanoparticle Inks for 3D Printing of ElectronicsAdvanced Electronic Materials2019166
95Bonding and thermal stability of implanted hydrogen in siliconJournal of Electronic Materials1975165
96Review paper: Recent developments in light extraction technologies of organic light emitting diodesElectronic Materials Letters2011162
97MXene–Silicon Van Der Waals Heterostructures for High‐Speed Self‐Driven PhotodetectorsAdvanced Electronic Materials2017162
98Spinodal decomposition and clustering in III/V alloysJournal of Electronic Materials1982161
99Characterization and optimization of the SiO2/SiC metal-oxide semiconductor interfaceJournal of Electronic Materials1995160
100Real-time stress evolution during Si1-xGex Heteroepitaxy: Dislocations, islanding, and segregationJournal of Electronic Materials1997160