Abstract
The increase of bias-dependent source access resistance, rs, with high gate bias is attributed to a sharp drop in transconductance, gm, and current gain cut-off frequency, fT, of high-electron-mobility transistors (HEMTs). Consequently, source and drain implant regions (n++ cap regions) are commonly used to obtain expected results in experimental devices as predicted theoretically. This paper investigates the effect of different doping profiles in n++ cap regions using a finite space in access regions on gm and fT with increasing bias. The device under test (DUT) is a beta-gallium oxide (β-Ga2O3)-based HEMT using an AlN barrier to create polarization-induced two-dimensional electron gas (2DEG). Dynamic access resistance is optimized by lateral Gaussian n++ doping characteristics using a finite gap between the ohmic contacts and barrier layer, which ensures high RF device performance. The technology computer-aided design (TCAD) simulation results for source access resistance are validated with an appropriate analytical model. It is observed that the peak electric field in the source access region can be controlled to delay electron velocity saturation, which yields higher mobility and reduced access resistance.
Similar content being viewed by others
References
S.J. Pearton, J. Yang, P.H. Cary IV, F. Ren, J. Kim, M.J. Tadjer, and M.A. Mastro, Appl. Phys. Rev. 5, 011301 (2018).
Z. Galazka, R. Uecker, K. Irmscher, M. Albrecht, D. Klimm, M. Pietsch, M. Brützam, R. Bertram, S. Ganschow, and R. Fornari, Cryst. Res. Technol. 45, 1229 (2010).
E.G. Víllora, K. Shimamura, Y. Yoshikawa, K. Aoki, and N. Ichinose, J. Cryst. Growth 270, 420 (2004).
M. Higashiwaki, K. Sasaki, A. Kuramata, T. Masui, and S. Yamakoshi, Appl. Phys. Lett. 100, 013504 (2012).
Y. Kang, K. Krishnaswamy, H. Peelaers, and C. G. Van de Walle, J. Phys. Condens. Matter 29, 23, 234001 (2017).
K. Ghosh and U. Singisetti, J. Appl. Phys. 122, 035702 (2017).
T. Palacios, S. Rajan, A. Chakraborty, S. Heikman, S. Keller, S.P. DenBaars, U.K. Mishra, and I.E.E.E. Trans, Electron Device 52, 2117 (2005).
T. Fang, R. Wang, H. Xing, S. Rajan, and D. Jena, IEEE Electron Device Lett. 33, 709 (2012).
K. Shinohara, D. Regan, A. Corrion, D. Brown, S. Burnham, P. J. Willadsen, I. Alvarado-Rodriguez, M. Cunningham, C. Butler, A. Schmitz, and S. Kim, in IEEE International Electron Devices Meeting (2011)
S. Ghosh, S. A. Ahsan, Y. S. Chauhan, and S. Khandelwal, in IEEE International Conference on Electron Devices and Solid-State Circuits (2016), p. 247
P. Cui, H. Liu, W. Lin, Z. Lin, A. Cheng, M. Yang, Y. Liu, C. Fu, Y. Lv, and C. Luan, IEEE Trans. Electron Devices 64, 1038 (2017).
Z. Xia, H. Xue, C. Joishi, J. McGlone, N.K. Kalarickal, S.H. Sohel, M. Brenner, A. Arehart, S. Ringel, S. Lodha, W. Lu, and S. Rajan, IEEE Electron Device Lett. 40, 1052 (2019).
Y. Zhang, A. Neal, Z. Xia, C. Joishi, J.M. Johnson, Y. Zheng, S. Bajaj, M. Brenner, D. Dorsey, K. Chabak, and G. Jessen, Appl. Phys. Lett. 112, 173502 (2018).
Maccioni, Maria Barbara, and Vincenzo Fiorentini. Applied Physics Express 9, 4, 041102 (2016)
W. Wei, Z. Qin, S. Fan, Z. Li, K. Shi, Q. Zhu, and G. Zhang, Nanoscale Res. Lett. 7, 562 (2012).
H. Sun, C.G. Torres Castanedo, L. Kaikai, L. Kuang-Hui, G. Wenzhe, L. Ronghui, L. Xinwei, L. Jingtao, L. Xiaohang, Appl. Phys. Lett. 111, 16, 162105 (2017)
Device Simulation Software, ATLAS User’s Manual (Santa Clara: Silvaco, 2009).
T. Oshima, Y. Kato, N. Kawano, A. Kuramata, S. Yamakoshi, S. Fujita, T. Oishi, M. Kasu, Applied Physics Express 10, 3, 035701 (2017).
A. Mock, R. Korlacki, C. Briley, V. Darakchieva, B. Monemar, Y. Kumagai, K. Goto, M. Higashiwaki, M. Schubert, Phys. Rev. B Condens. Matter 96, 24, 245205 (2017)
Z. Zhang, E. Farzana, A.R. Arehart, and S.A. Ringel, Appl. Phys. Lett. 108, 052105 (2016).
O. Ambacher, R. Dimitrov, M. Stutzmann, B.E. Foutz, M.J. Murphy, J.A. Smart, J.R. Shealy, N.G. Weimann, K. Chu, M. Chumbes, and B. Green, Phys. Status Solidi (b) 216, 381 (1999).
I.P. Smorchkova, S. Keller, S. Heikman, C.R. Elsass, B. Heying, P. Fini, J.S. Speck, and U.K. Mishra, Appl. Phys. Lett. 77, 3998 (2000).
F. Bernardini, V. Fiorentini, D. Vanderbilt, Phys. Rev. B 15; 56(16), R10024 (1997)
T. Zaki, R. Rodel, F. Letzkus, H. Richter, U. Zschieschang, H. Klauk, and J.N. Burghartz, IEEE Electron Device Lett. 34, 520 (2013).
Acknowledgments
This publication is an outcome of the SERB project and the collaborative R&D work undertaken in the project under the Visvesvaraya PhD Scheme of the Ministry of Electronics and Information Technology, Government of India, being implemented by Digital India Corporation.
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no conflict of interest.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Singh, R., Lenka, T.R. & Nguyen, H.P.T. Optimization of Dynamic Source Resistance in a β-Ga2O3 HEMT and Its Effect on Electrical Characteristics. J. Electron. Mater. 49, 5266–5271 (2020). https://doi.org/10.1007/s11664-020-08261-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-020-08261-0