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Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface

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An Erratum to this article was published on 11 April 2014

Abstract

Wetting of Cu substrates by Sn-Zn eutectic-based alloys with 0.5, 1, and 1.5 wt.% of Ag was studied. Wetting tests were performed at 523 K, in the presence of ALU33® flux, for 15, 30 and 60 s, respectively. The results indicated that the content of Ag in the alloys does not have significant effect on the contact angle. Selected, solidified Sn-8.8Zn-xAg/Cu couples were cross-sectioned and subjected to SEM-EDS study of the interfacial microstructure. The results revealed that the microstructure of the Sn-Zn-Ag/Cu interface evolves with time and is different from Sn-Zn/Cu interface. The continuous interlayers are observed at the interface. Composition of the interlayers was analyzed with EDS and their thickness measured.

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Acknowledgments

This work was financed under the framework of the project POIG.01.01.02-00-015/09, co-funded by the European Regional Development Fund (ERDF) and the Government of Poland under the Innovative Economy Program in the years 2010-2013.

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Authors and Affiliations

  1. Institute of Metallurgy and Materials Science, Polish Academy of Sciences, ul. Reymonta 25, 30-059, Kraków, Poland

    Katarzyna Berent, Przemysław Fima, Tomasz Ganacarz & Janusz Pstruś

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  1. Katarzyna Berent
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  2. Przemysław Fima
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  3. Tomasz Ganacarz
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  4. Janusz Pstruś
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Correspondence to Katarzyna Berent.

Additional information

This article is an invited submission to JMEP selected from presentations at the Symposia “Wetting,” “Interface Design,” and “Joining Technologies” belonging to the Topic “Joining and Interface Design” at the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2013), held September 8-13, 2013, in Sevilla, Spain, and has been expanded from the original presentation.

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Berent, K., Fima, P., Ganacarz, T. et al. Wetting and Microstructure Evolution of the Sn-Zn-Ag/Cu Interface. J. of Materi Eng and Perform 23, 1630–1633 (2014). https://doi.org/10.1007/s11665-014-0929-4

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  • DOI: https://doi.org/10.1007/s11665-014-0929-4

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