Abstract
Uncooled infrared (IR) photodetectors for telecommunications, optical processor interconnects, and focal plane arrays are advantageously integrated into systems that are silicon based through advanced thin-film technologies. This paper reviews challenges of materials, microstructures, interfaces, and reactions of thin-film materials and technologies posed by such applications.
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Walter F. Kosonocky, Review of Schottky-Barrier Imager Technology, SPIE Advent Technologies Series, Vol. AT2: Current Overviews in Optical Science and Engineering II, ed. Richard Feinberg (Bellingham, WA: SPIE, 1990), pp. 446–70.
W.F. Kosonocky, M.B. Kaplinsky, N.J. McCaffrey, E.S. Hou, C.N. Manikopoulos, N.M. Ravindra, S. Belikov, J. Li, and V. Patel, Proc. SPIE 2225, 26 (1994).
Quantum Well Intersubband Transition Physics and Devices, eds. H.C. Liu, B.F. Levine, and J.Y. Andersson (Dordrecht: Kluwer Academic, 1994).
H. Schneider, C. Schönbein, G. Bihlmann, P. van Son, and H. Sigg, Appl. Phys. Lett. 70, 1602 (1997).
N. Savage, IEEE Spectrum 39, 32 (2002).
U.S. Defense Advanced Research Projects Agency, Electronic & Photonic Integrated Circuit (EPIC), http://www.darpa.mil/baa/baa04-15.htm (accessed June 9, 2004).
L Pavesi, J. Phys.: Condens. Matter 15, R1169 (2003).
A. Liu, R. Jones, L. Liao, D. Samara-Rubio, D. Rubin, O. Cohen, R. Nicolaescu, and M. Paniccia, Nature 427, 615 (2004).
A.T. Fiory and N.M. Ravindra, J. Electron. Mater. 92, 1043 (2003).
M.K. Emsley, O.I. Dosunmu, P. Muller, M.S. Ünlü, and Y. Leblebici, Proc. SPIE Active and Passive Optical Components for WDM Communications III, 5246, 409 (2003).
N.M. Ravindra, K. Ravindra, S. Mahendra, B. Sopori, and A.T. Fiory, J. Electron. Mater. 92, 1052 (2003).
S.M. Csutak, J.D. Schaub, W.E. Wu, and J.C. Campbell, IEEE Photon. Technol. Lett. 14, 516 (2002).
B. Yang, J.D. Schaub, S.M. Csutak, D.L. Rogers, and J.C. Campbell, IEEE Photonics Technol. Lett. 15, 745 (2003).
M. Yang, D.L. Rogers, J.D. Schaub, J.J. Welser, D.M. Kuchta, D.C. Boyd, F. Rodier, P.A. Rabidoux, J.T. Marsh, A.D. Ticknor, Q. Yang, A. Upham, and S.C. Ramac, IEEE Electron. Dev. Lett. 23, 395 (2002).
E. Chen and S.Y. Chou, Appl. Phys. Lett. 70, 753 (1997).
S.P. Murarka, Silicides for VLSI Applications (New York: Academic Press, 1983).
K. Solt, H. Melchior, U. Kroth, P. Kuschnerus, V. Persch, H. Rabus, M. Richter, and G. Ulm, Appl. Phys. Lett. 69, 3662 (1996).
Y. Wu, B.M. Armstrong, H.S. Gamble, Z. Hu, Q. Chen, S. Yang, V.F. Fusco, and J.A. Carson Stewart, IEEE Trans. Microwave Theory and Techniques 46, 641 (1998).
S.M. Sze, Physics of Semiconductor Devices, 2nd ed. (New York: John Wiley & Sons, 1981), ch. 13, pp. 743–790.
G. Wöhl, C. Parry, E. Kasper, M. Jutzi, and M. Berroth (Paper presented at 2003 IEEE Int. Solid State Circuits Conf., San Francisco, CA, 2003).
J. Oh, S.K. Banerjee, and J.C. Campbell, IEEE Photonics Technol. Lett. 16, 581 (2004).
A.T. Fiory, J.C. Bean, R. Hull, and S. Nakahara, Phys. Rev. B 31, 4063 (1985).
O. Qasaimeh, Z. Ma, P. Bhattacharya, and E.T. Croke, J. Lightwave Technol. 18, 1548 (2000).
T. Tashiro, T. Tatsumi, M. Sugiyama, T. Hashimoto, and T. Morikawa, IEEE Trans. Electron. Dev. 44, 545 (1997).
M. Mitra, U.S. patent application 2004/0108564 (10 June 2004); U.S. patent application 2004/0108461 (10 June 2004).
R.W. Wood, U.S. patent application 2003/0057371 (27 March 2003).
M.P. Lepselter, U.S. patent application 3,411,048 (Nov. 12, 1968).
J.M. Andrews and M.P. Lepselter, U. S. patent 3,719,797 (6 March 1973).
J.E. Murguia, P.K. Tedrow, F.D. Shepherd, D. Leahy, and M.M. Weeks, SPIE 3698, 361 (1999).
G. Sarusi, Proc. SPIE 4820, 919 (2003).
O.J. Milton, R.M. Walker, and R.W. McMillan, Proc. SPIE 4719, 167 (2002).
M.L. Reed and T.N. Blalock, U.S. patent application 2003/0141453 (31 July 2003).
A. Bain, J.L. Martin, and E. Mottin, Sensor and Materials 12, 365 (2000).
A.J. Syllaios, T.R. Schimert, R.W. Gooch, W.L. McCardel, B.A. Ritchey, and J.H. Tregilgas, Mater. Res. Soc. Conf. Proc. 609, A14.4.1-6 (2001); T.R. Schimert, N. Cunningham, G.L. Francisco, R.W. Gooch, J. Gooden, P. McCardel, B.E. Neal, B. Ritchey, J. Rife, A.J. Syllaios, J.H. Tregilgas, J.F. Brady III, J. Gilstrap, and S.J. Ropson, Proc. SPIE 4232, 187 (2001).
E. Iborra, M. Clement, L. V. Herrero, and J. Sangrador, J. Microelectromech. Systems 11, 322 (2002).
H.K. Kang, Y.g H. Han, H.J. Shin, S. Moon, and T.H. Kim, J. Vac. Sci. Technol. B 21, 1027 (2003).
H. Wang, X. Yi, G. Huang, J. Xiao, X. Li, and S. Chen, Infrared Phys. Technol. 45, 53 (2004).
R.T. Rajendra Kumar, B. Karunagaran, D. Mangalaraj, Sa.K. Narayandass, P. Manoravi, M. Joseph, and V. Gopal, Smart Mater. Struct. 12, 188 (2003).
J. Diezhandino, G. Vergara, G. Pérez, I. Génova, M.T. Rodrigo, F.J. Sánchez, M.C. Torquemada, V. Villamayor, J. Plaza, I. Catalán, R. Almazán, M. Verdú, P. Rodríguez, L.J. Gómez, and M.T. Montojo, Appl. Phys. Lett. 83, 2751 (2003).
C.M. Travers, A. Jahanzeb, D.P. Butler, and Z. Çelik-Butler, J. Microelectromech. Systems 6, 271 (1997).
A. Jahanzeb, C.M. Travers, D.P. Butler, Z. Çelik-Butler, and J.E. Gray, Appl. Phys. Lett. 70, 3495 (1997).
A. Yildiz, Z. Çelik-Butler, and D.P. Butler, IEEE Sensors J. 4, 112 (2004).
M. Noda, H.P. Xu, and T. Mukaigawa, Sensor Mater. 12, 375 (2000).
H.-K. Lee, J.-B. Yoon, E. Yoon, S.-B. Ju, Y.-J. Yong, W. Lee, and S.-G. Kim, IEEE Trans. Electron. Dev. 46, 1489 (1999).
I. Codreanu and G.D. Boreman, Infrared Physics and Technology 43, 335 (2002).
F.J. González, M. Abdel-Rahman, and G.D. Boreman, Microwave and Optical Technol. Lett. 38, 235 (2003).
M.A. Gritza, I. Puscasu, D. Spencer, and G.D. Boreman, J. Vac. Sci. Technol. B 21, 2608 (2003).
D.S. Tezcan, S. Eminoglu, and T. Akin, IEEE Trans. Electron Dev. 50, 494 (2003).
C.-C. Liu and C.H. Mastrangelo, IEEE J. Solid State Circuits 35, 527 (2000).
T. Perazzo, M. Mao, O. Kwon, A. Majumdara, J.B. Varesi, and P. Norton, Appl. Phys. Lett. 74, 3567 (1999).
J.L. Corbeil, N.V. Lavrik, and S. Rajic, P.G. Datskosa, Appl. Phys. Lett. 81, 1306 (2002).
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Mehta, V.R., Shet, S., Ravindra, N.M. et al. Silicon-integrated uncooled infrared detectors: Perspectives on thin films and microstructures. J. Electron. Mater. 34, 484–490 (2005). https://doi.org/10.1007/s11664-005-0055-z
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DOI: https://doi.org/10.1007/s11664-005-0055-z