Citation of paper, Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

Authors Citing This Paper

AuthorCiting PapersAuthor's PapersAuthor's CitationsAuthor's IF
Chih-Ming Chen71432,4661.9
Christopher M Gourlay71232,7943.4
Raymundo Arroyave62014,4043.8
Jae Pil Jung5931,0712
Amauri Garcia53578,0712.3
Zhaolong4213554.2
Shih-kang Lin4721,0872.4
40
Chunqing Wang42202,7631.3
Gerhard Dehm33579,2983.4
Song-bai Xue31302,0272.3
Spinelli, Je31753,0072.2
Temitope Theophilus Dele-Afolabi3262423
Yuefeng Li3870.7
Alaa F Abd El-Rehim3514675.2
Guang Zeng3601,6583.5
Kaiyang Zeng32467,0143.7
chuantong Chen3981,0362.5
Ahmed Sharif3651,3521.7
Jamaluddin Abdullah2151460.9
Joël Cugnoni2922,6632.9
Emma Paola Maria Virginia ANGELINI2177
Haibo Yu2201721.8
Maurice N Collins2964,51813.8
Michael G Pecht282519,7763.3
20
Xingke Zhao2641,0992.3
Nduka Nnamdi Ekere24202.9
Gilda Zanicchi2207262
Jolanta Janczak-Rusch2731,2061.7
Jenn-Ming Song2921,2611
Paul Conway21841,9350.9
Mohd Nasir Tamin2493091.3
Patrick Grant22016,1643.6
Zhi Jin23100.7
K Y Simon Ng2843,1393.3
Jihua Huang21592,8003
Yu-An Shen2312352.4
Nikhilesh Chawla23059,6772.9
Chao-hong Wang2621,1711.8
Nobumichi Tamura22968,4133.4
Shijo Nagao21523,2833
Tadatomo T Suga24155,8681.1
Yao Yao21512,3683
Kazuhiro Nogita22096,0612.8
Hossein Fallahi26802.6
Xiu-Chen Zhao2537793.2
Dr SATYANARAYAN2202261.6
Colin Johnston2702,0222.1
Bismarck Luiz Silva2444902

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Journal of Electronic Materials681.9★★★
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Soldering and Surface Mount Technology151.4★★★
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing125.3★★★
Acta Materialia108.4★★★
Materials Transactions91.3★★★
Advanced Materials Research60.5
Microelectronic Engineering62.5★★★
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Materials & Design4
Materials Science Forum40.4★★★
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IEEE Transactions on Components and Packaging Technologies4
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Journal of Applied Physics42.5★★★
Materials Letters33.3★★★
Materialia33.2
Springer Theses30.1
Science and Technology of Welding and Joining33.7★★★
Metals and Materials International32.4★★★
Advanced Engineering Materials33.5★★★
Transactions of Nonferrous Metals Society of China33.3★★★
Journal of Materials Engineering and Performance31.6★★★
Materials Science and Technology31.5★★★
Scripta Materialia35.6★★★
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IOP Conference Series: Materials Science and Engineering30.4★★★
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IEEE Transactions on Components, Packaging and Manufacturing Technology21.7★★★
Lecture Notes in Mechanical Engineering20.4
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