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Journal of Electronic Materials
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Top Articles
Journal of Electronic Materials
Materials Engineering
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Electrical Engineering
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Physics
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Electronic Materials
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Inorganic Chemistry
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Condensed Matter Physics
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Materials Chemistry
1.9
(top 9%)
Impact Factor
2
(top 9%)
extended IF
108
(top 3%)
H-Index
6.5K
authors
14.6K
papers
182.2K
citations
2.9K
citing journals
47.2K
citing authors
Most Cited Articles of Journal of Electronic Materials
Title
Year
Citations
Estimation of the thermal band gap of a semiconductor from seebeck measurements
1999
562
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
2000
440
High Thermoelectric Performance of Dually Doped ZnO Ceramics
2009
313
A study of deep levels in GaAs by capacitance spectroscopy
1975
308
Ultraviolet detectors based on epitaxial ZnO films grown by MOCVD
2000
301
Thermal behavior of silver nanoparticles for low-temperature interconnect applications
2005
300
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
1994
275
Nanostructured thermoelectric materials
2005
263
Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni
2002
252
Lead (Pb)-free solders for electronic packaging
1994
252
Automotive Applications of Thermoelectric Materials
2009
250
Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control
1998
245
Thermoelectric quantum-dot superlattices with high ZT
2000
241
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process
2015
240
Characterization of eutectic Sn-Bi solder joints
1992
232
Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders
1997
231
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
2007
231
Microstructure evolution of eutectic Sn-Ag solder joints
1994
228
A viable tin-lead solder substitute: Sn-Ag-Cu
1994
221
Capillary instabilities in thin films
1990
217
Progress in silicon carbide semiconductor electronics technology
1995
210
Improved oxidation procedures for reduced SiO2/SiC defects
1996
209
Bandgap and lattice constant of GaInAsP as a function of alloy composition
1974
208
Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics
2011
203
Wide-gap semiconductor InGaN and InGaAln grown by MOVPE
1992
201
previous
1990
1991
1992
How are inpact factors calculated?
The impact factor (IF) is calculated by counting citations from peer-reviewed journals only.
extended IF
also counts citations from books and conference papers. However, no patent, abstract, working papers, online documents, etc., are covered.
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