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192 peer-reviewed articles • 17,569 peer-reviewed citations • Sorted by year • Download PDF (PDF by citations)
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1Porous mesh manifold for enhanced boiling performance
Applied Thermal Engineering, 2025, 260, 124918
6.58Citations (PDF)
2Triply periodic minimal surfaces for thermo-mechanical protection
Scientific Reports, 2025, 15,
3.427Citations (PDF)
3Development of a capillary-driven two-phase microcooler using copper wiremesh 3D manifold and silicon micropin fin wicks
International Journal of Mechanical Sciences, 2025, 305, 110781
8.84Citations (PDF)
4Boiling-induced thermal degradation of copper inverse opals and its mitigation
International Communications in Heat and Mass Transfer, 2024, 151, 107250
5.514Citations (PDF)
5Development of a Hybrid Capillary-Driven Single-Phase and Two-Phase Micro-Cooler for Power Electronics Cooling
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14, 810-823
1.714Citations (PDF)
6Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14, 1025-1035
1.71Citations (PDF)
7Picosecond carrier dynamics in InAs and GaAs revealed by ultrafast electron microscopy
Science Advances, 2024, 10,
10.922Citations (PDF)
8Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024, 14, 1367-1373
1.78Citations (PDF)
9Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels
Energy Conversion and Management, 2024, 315, 118809
10.544Citations (PDF)
10Non-volatile electrically programmable integrated photonics with a 5-bit operation
Nature Communications, 2023, 14,
13.7139Citations (PDF)
11Electro-Thermal Confinement Enables Improved Superlattice Phase Change Memory
IEEE Electron Device Letters, 2022, 43, 204-207
3.340Citations (PDF)
12Multiobjective Optimization of Graded, Hybrid Micropillar Wicks for Capillary-Fed Evaporation
Langmuir, 2022, 38, 221-230
3.615Citations (PDF)
13Non‐Contact Mass Density and Thermal Conductivity Measurements of Organic Thin Films Using Frequency–Domain Thermoreflectance
Advanced Materials Interfaces, 2022, 9,
4.09Citations (PDF)
14Heat Conductor–Insulator Transition in Electrochemically Controlled Hybrid Superlattices
Nano Letters, 2022, 22, 5443-5450
8.716Citations (PDF)
15A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks
International Journal of Heat and Mass Transfer, 2022, 194, 123087
5.598Citations (PDF)
16Understanding Interface-Controlled Resistance Drift in Superlattice Phase Change Memory
IEEE Electron Device Letters, 2022, 43, 1669-1672
3.331Citations (PDF)
17Deposition and Fabrication of Sputtered Bismuth Telluride and Antimony Telluride for Microscale Thermoelectric Energy Harvesters
Thin Solid Films, 2021, 717, 138444
1.939Citations (PDF)
18Performance and Manufacturing of Silicon-Based Vapor Chambers
Applied Mechanics Reviews, 2021, 73,
13.752Citations (PDF)
19Achieving High Thermoelectric Performance and Metallic Transport in Solvent‐Sheared PEDOT:PSS
Advanced Electronic Materials, 2021, 7,
4.952Citations (PDF)
20Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition
ACS Applied Materials & Interfaces, 2021, 13, 21905-21913
8.010Citations (PDF)
21Tuning electrical and interfacial thermal properties of bilayer MoS 2 via electrochemical intercalation
Nanotechnology, 2021, 32, 265202
2.65Citations (PDF)
22Simultaneous thickness and thermal conductivity measurements of thinned silicon from 100 nm to 17 μm
Applied Physics Letters, 2021, 118,
3.020Citations (PDF)
23Thermal expansion characterization of thin films using harmonic Joule heating combined with atomic force microscopy
Applied Physics Letters, 2021, 118,
3.012Citations (PDF)
24An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink
Applied Thermal Engineering, 2021, 194, 117012
6.549Citations (PDF)
25Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films
Nano Letters, 2021, 21, 5984-5990
8.767Citations (PDF)
26Design and optimization of well-ordered microporous copper structure for high heat flux cooling applications
International Journal of Heat and Mass Transfer, 2021, 173, 121241
5.551Citations (PDF)
27Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits
International Journal of Heat and Mass Transfer, 2021, 175, 121192
5.552Citations (PDF)
28Integrated cooling (i-Cool) textile of heat conduction and sweat transportation for personal perspiration management
Nature Communications, 2021, 12,
13.7208Citations (PDF)
29Thermal Characterization of Metal–Oxide Interfaces Using Time-Domain Thermoreflectance with Nanograting Transducers
ACS Applied Materials & Interfaces, 2021, 13, 58059-58065
8.021Citations (PDF)
30Engineering Thermal Transport across Layered Graphene–MoS2 Superlattices
ACS Nano, 2021, 15, 19503-19512
15.344Citations (PDF)
31Investigation of 3D manifold architecture heat sinks in air-cooled condensers
Applied Thermal Engineering, 2020, 167, 114700
6.521Citations (PDF)
32Effect of Adventitious Carbon on Pit Formation of Monolayer MoS2
Advanced Materials, 2020, 32,
24.517Citations (PDF)
33Two-Fold Reduction of Switching Current Density in Phase Change Memory Using Bi₂Te₃ Thermoelectric Interfacial Layer
IEEE Electron Device Letters, 2020, 41, 1657-1660
3.331Citations (PDF)
34Tunable Dielectric and Thermal Properties of Oxide Dielectrics via Substrate Biasing in Plasma-Enhanced Atomic Layer Deposition
ACS Applied Materials & Interfaces, 2020, 12, 44912-44918
8.015Citations (PDF)
35Bicontinuous Mesoporous Metal Foams with Enhanced Conductivity and Tunable Pore Size and Porosity via Electrodeposition for Electrochemical and Thermal Systems
ACS Applied Nano Materials, 2020, 3, 12408-12415
5.32Citations (PDF)
36Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices
Applied Physics Letters, 2020, 116,
3.031Citations (PDF)
37Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution
International Journal of Heat and Mass Transfer, 2020, 152, 119569
5.558Citations (PDF)
38Phase Change Dynamics and Two-Dimensional 4-Bit Memory in Ge2Sb2Te5 via Telecom-Band Encoding
ACS Photonics, 2020, 7, 480-487
6.041Citations (PDF)
39Lithography and Etching‐Free Microfabrication of Silicon Carbide on Insulator Using Direct UV Laser Ablation
Advanced Engineering Materials, 2020, 22,
2.911Citations (PDF)
40High-Frequency Water Vapor Sorption Cycling Using Fluidization of Metal-Organic Frameworks
Cell Reports Physical Science, 2020, 1, 100057
4.939Citations (PDF)
41Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Journal of Electronic Packaging, Transactions of the ASME, 2020, 142,
1.73Citations (PDF)
42Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Journal of Electronic Packaging, Transactions of the ASME, 2020, 142,
1.73Citations (PDF)
43Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Journal of Electronic Packaging, Transactions of the ASME, 2020, 142,
1.74Citations (PDF)
44Steady-State Parametric Optimization and Transient Characterization of Heat Flow Regulation With Binary Diffusion
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10, 1996-2007
1.71Citations (PDF)
45Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa
International Journal of Heat and Mass Transfer, 2019, 141, 145-155
5.553Citations (PDF)
46Understanding the switching mechanism of interfacial phase change memory
Journal of Applied Physics, 2019, 125,
2.051Citations (PDF)
47Quasi-Ballistic Thermal Transport Across MoS2 Thin Films
Nano Letters, 2019, 19, 2434-2442
8.7100Citations (PDF)
48Strongly tunable anisotropic thermal transport in MoS 2 by strain and lithium intercalation: first-principles calculations
2D Materials, 2019, 6, 025033
4.241Citations (PDF)
49Thermal conductivity of crystalline AlN and the influence of atomic-scale defects
Journal of Applied Physics, 2019, 126,
2.0161Citations (PDF)
50Tunable, passive thermal regulation through liquid to vapor phase change
Applied Physics Letters, 2019, 115,
3.010Citations (PDF)
51Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
International Journal of Heat and Mass Transfer, 2019, 130, 1108-1119
5.5183Citations (PDF)
52Experimental Characterization of Microfabricated Thermoelectric Energy Harvesters for Smart Sensor and Wearable Applications
Advanced Materials Technologies, 2018, 3,
5.825Citations (PDF)
53Direct Visualization of Thermal Conductivity Suppression Due to Enhanced Phonon Scattering Near Individual Grain Boundaries
Nano Letters, 2018, 18, 3466-3472
8.7143Citations (PDF)
54Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
Thin Solid Films, 2018, 649, 24-29
1.96Citations (PDF)
55Anti-Hermitian photodetector facilitating efficient subwavelength photon sorting
Nature Communications, 2018, 9,
13.735Citations (PDF)
56Porous micropillar structures for retaining low surface tension liquids
Journal of Colloid and Interface Science, 2018, 514, 316-327
9.941Citations (PDF)
57Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Journal of Electronic Packaging, Transactions of the ASME, 2018, 140,
1.721Citations (PDF)
58Improving the performance of Ge2Sb2Te5 materials via nickel doping: Towards RF-compatible phase-change devices
Applied Physics Letters, 2018, 113,
3.044Citations (PDF)
59Optimizing the design of composite phase change materials for high thermal power density
Journal of Applied Physics, 2018, 124,
2.057Citations (PDF)
60An electrochemical thermal transistor
Nature Communications, 2018, 9,
13.7160Citations (PDF)
61Phonon Scattering in Silicon by Multiple Morphological Defects: A Multiscale Analysis
Journal of Electronic Materials, 2018, 47, 5148-5157
2.314Citations (PDF)
62Enhanced Heat Transfer Using Microporous Copper Inverse Opals
Journal of Electronic Packaging, Transactions of the ASME, 2018, 140,
1.721Citations (PDF)
63Tailoring Permeability of Microporous Copper Structures through Template Sintering
ACS Applied Materials & Interfaces, 2018, 10, 30487-30494
8.027Citations (PDF)
64Enhanced Capillary‐Fed Boiling in Copper Inverse Opals via Template Sintering
Advanced Functional Materials, 2018, 28,
17.080Citations (PDF)
65A method for quantifying in plane permeability of porous thin films
Journal of Colloid and Interface Science, 2018, 530, 667-674
9.96Citations (PDF)
66Phonon conduction in GaN-diamond composite substrates
Journal of Applied Physics, 2017, 121,
2.097Citations (PDF)
67Enhanced Thermal Conduction Through Nanostructured Interfaces
Nanoscale and Microscale Thermophysical Engineering, 2017, 21, 134-144
1.924Citations (PDF)
68Phonon conduction in silicon nanobeams
Applied Physics Letters, 2017, 110,
3.026Citations (PDF)
69Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper
Advanced Functional Materials, 2017, 27,
17.0135Citations (PDF)
70Temperature-Dependent Thermal Boundary Conductance of Monolayer MoS2 by Raman Thermometry
ACS Applied Materials & Interfaces, 2017, 9, 43013-43020
8.0176Citations (PDF)
71Modulation of thermal and thermoelectric transport in individual carbon nanotubes by fullerene encapsulation
Nature Materials, 2017, 16, 892-897
33.3131Citations (PDF)
72Phonon Conduction in Silicon Nanobeam Labyrinths
Scientific Reports, 2017, 7,
3.434Citations (PDF)
73Thermal Conduction across Metal–Dielectric Sidewall Interfaces
ACS Applied Materials & Interfaces, 2017, 9, 30100-30106
8.09Citations (PDF)
74Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials
ACS Applied Materials & Interfaces, 2017, 9, 42067-42074
8.083Citations (PDF)
75Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond
Journal of Applied Physics, 2016, 119,
2.0112Citations (PDF)
76Enhanced phonon scattering by nanovoids in high thermoelectric power factor polysilicon thin films
Applied Physics Letters, 2016, 109,
3.022Citations (PDF)
77Quasi-ballistic Electronic Thermal Conduction in Metal Inverse Opals
Nano Letters, 2016, 16, 2754-2761
8.781Citations (PDF)
78Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
Journal of Electronic Packaging, Transactions of the ASME, 2016, 138,
1.772Citations (PDF)
79Nonhomogeneous morphology and the elastic modulus of aligned carbon nanotube films
Journal of Micromechanics and Microengineering, 2015, 25, 115023
1.96Citations (PDF)
80Cross-Plane Phonon Conduction in Polycrystalline Silicon Films
Journal of Heat Transfer, 2015, 137,
1.512Citations (PDF)
81Burst behavior at a capillary tip: Effect of low and high surface tension
Journal of Colloid and Interface Science, 2015, 455, 1-5
9.923Citations (PDF)
82Thermal characterization and analysis of microliter liquid volumes using the three-omega method
Review of Scientific Instruments, 2015, 86,
1.518Citations (PDF)
83Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015, 5, 737-744
1.7141Citations (PDF)
84Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites
ACS Applied Materials & Interfaces, 2015, 7, 19251-19259
8.0126Citations (PDF)
85Energy-Efficient Phase-Change Memory with Graphene as a Thermal Barrier
Nano Letters, 2015, 15, 6809-6814
8.7145Citations (PDF)
86Power density optimization for micro thermoelectric generators
Energy, 2015, 93, 2006-2017
8.979Citations (PDF)
87NEAR-JUNCTION THERMAL MANAGEMENT: THERMAL CONDUCTION IN GALLIUM NITRIDE COMPOSITE SUBSTRATES
Annual Review of Heat Transfer, 2015, 18, 7-45
1.268Citations (PDF)
88Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4, 1906-1913
1.722Citations (PDF)
89Thermal conduction in lattice–matched superlattices of InGaAs/InAlAs
Applied Physics Letters, 2014, 105,
3.042Citations (PDF)
90Phonon scattering in strained transition layers for GaN heteroepitaxy
Physical Review B, 2014, 89,
3.4117Citations (PDF)
91Nanoscale thermal transport. II. 2003–2012
Applied Physics Reviews, 2014, 1, 011305
10.41,617Citations (PDF)
92Analysis of oxide (Al2O3, CuO, and ZnO) and CNT nanoparticles disaggregation effect on the thermal conductivity and the viscosity of nanofluids
International Journal of Precision Engineering and Manufacturing, 2014, 15, 703-710
2.721Citations (PDF)
93Material and manufacturing cost considerations for thermoelectrics
Renewable and Sustainable Energy Reviews, 2014, 32, 313-327
16.4474Citations (PDF)
94Ultrafast Characterization of Phase-Change Material Crystallization Properties in the Melt-Quenched Amorphous Phase
Nano Letters, 2014, 14, 3419-3426
8.7114Citations (PDF)
95Impact of Annealing on the Thermoelectric Properties of Ge2Sb2Te5 Films
Materials Research Society Symposia Proceedings, 2013, 1490, 223-228
0.10Citations (PDF)
96$ per W metrics for thermoelectric power generation: beyond ZT
Energy and Environmental Science, 2013, 6, 2561-2571
30.8235Citations (PDF)
97Thermal conduction phenomena in carbon nanotubes and related nanostructured materials
Reviews of Modern Physics, 2013, 85, 1295-1326
40.7433Citations (PDF)
98From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology
Journal of Heat Transfer, 2013, 135,
1.5107Citations (PDF)
99Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3, 1524-1532
1.725Citations (PDF)
100Phonon and electron transport through Ge2Sb2Te5 films and interfaces bounded by metals
Applied Physics Letters, 2013, 102,
3.085Citations (PDF)
101Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films
Proceedings of the National Academy of Sciences of the United States of America, 2013, 110, 20426-20430
7.543Citations (PDF)
102Improved Thermal Interfaces of GaN–Diamond Composite Substrates for HEMT Applications
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3, 79-85
1.7114Citations (PDF)
103High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
Journal of Electronic Packaging, Transactions of the ASME, 2013, 135,
1.723Citations (PDF)
104Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance
Applied Physics Letters, 2013, 102,
3.044Citations (PDF)
105THERMAL TRANSPORT IN PHASE CHANGE MEMORY MATERIALS
Annual Review of Heat Transfer, 2013, 16, 397-428
1.220Citations (PDF)
106Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory
Japanese Journal of Applied Physics, 2012, 51, 02BD06
1.96Citations (PDF)
107Electrothermal phenomena in zinc oxide nanowires and contacts
Applied Physics Letters, 2012, 100,
3.013Citations (PDF)
108Phonon Conduction in Periodically Porous Silicon Nanobridges
Nanoscale and Microscale Thermophysical Engineering, 2012, 16, 199-219
1.955Citations (PDF)
109Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness
Applied Physics Letters, 2012, 100, 161905
3.032Citations (PDF)
110Electrothermal Modeling and Design Strategies for Multibit Phase-Change Memory
IEEE Transactions on Electron Devices, 2012, 59, 3561-3567
2.729Citations (PDF)
111Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness
Journal of Applied Physics, 2012, 112,
2.052Citations (PDF)
112Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics
Journal of Applied Physics, 2012, 112,
2.021Citations (PDF)
113Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling
Nanotechnology, 2012, 23, 205201
2.661Citations (PDF)
114Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness
Nano Letters, 2012, 12, 683-686
8.766Citations (PDF)
115Low Thermal Resistances at GaN–SiC Interfaces for HEMT Technology
IEEE Electron Device Letters, 2012, 33, 378-380
3.3101Citations (PDF)
116Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm
Nano Letters, 2012, 12, 3121-3126
8.766Citations (PDF)
117Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators
Carbon, 2012, 50, 347-355
10.746Citations (PDF)
118Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films
Carbon, 2012, 50, 3789-3798
10.750Citations (PDF)
119Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate
Journal of Microelectromechanical Systems, 2012, 21, 4-6
2.012Citations (PDF)
120Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory
Japanese Journal of Applied Physics, 2012, 51, 02BD06
1.92Citations (PDF)
121Thermomechanical Formation an Thermal Sensing of Nanometer-Scal Indenatations in PMMA Thin Films for Parallel and Dense AFM Data Storage
Materials Research Society Symposia Proceedings, 2011, 649,
0.10Citations (PDF)
122Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory
IEEE Electron Device Letters, 2011, 32, 961-963
3.316Citations (PDF)
123Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites with High Packing Density
ACS Nano, 2011, 5, 4818-4825
15.3480Citations (PDF)
124Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films
Journal of Applied Physics, 2011, 109,
2.080Citations (PDF)
125Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage
IEEE Transactions on Electron Devices, 2011, 58, 584-592
2.766Citations (PDF)
126Adiabatic and diabatic two-phase venting flow in a microchannel
International Journal of Multiphase Flow, 2011, 37, 1135-1146
3.532Citations (PDF)
127Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger
International Journal of Heat and Mass Transfer, 2011, 54, 5504-5516
5.5107Citations (PDF)
1283-D visualization of flow in microscale jet impingement systems
International Journal of Thermal Sciences, 2011, 50, 325-331
5.014Citations (PDF)
129Temperature-dependent aggregation and diffusion in nanofluids
International Journal of Heat and Mass Transfer, 2011, 54, 797-806
5.550Citations (PDF)
130Impact of channel geometry on two-phase flow in fuel cell microchannels
Journal of Power Sources, 2011, 196, 5012-5020
7.922Citations (PDF)
131Thermal microdevices for biological and biomedical applications
Journal of Thermal Biology, 2011, 36, 209-218
2.735Citations (PDF)
132Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage
Journal of Applied Physics, 2011, 110,
2.016Citations (PDF)
133Microthermal Stage for Electrothermal Characterization of Phase-Change Memory
IEEE Electron Device Letters, 2011, 32, 952-954
3.313Citations (PDF)
134High temperature thermal properties of thin tantalum nitride films
Applied Physics Letters, 2011, 99,
3.043Citations (PDF)
135Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials
IEEE Electron Device Letters, 2011, 32, 1281-1283
3.321Citations (PDF)
136Phase Change Memory
Proceedings of the IEEE, 2010, 98, 2201-2227
9.61,661Citations (PDF)
137Characterization of the wettability of thin nanostructured films in the presence of evaporation
Journal of Colloid and Interface Science, 2010, 349, 354-360
9.933Citations (PDF)
138Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation
International Journal of Multiphase Flow, 2010, 36, 608-619
3.549Citations (PDF)
139Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels
Journal of Micromechanics and Microengineering, 2010, 20, 045018
1.948Citations (PDF)
140Aggregate fractal dimensions and thermal conduction in nanofluids
Journal of Applied Physics, 2010, 108,
2.091Citations (PDF)
141Nanofluid Convection in Microtubes
Journal of Heat Transfer, 2010, 132,
1.536Citations (PDF)
142Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films
Nano Letters, 2010, 10, 2395-2400
8.767Citations (PDF)
143Thermal Boundary Resistance Measurements for Phase-Change Memory Devices
IEEE Electron Device Letters, 2010, 31, 56-58
3.3115Citations (PDF)
144Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films
Physical Review B, 2009, 80,
3.48Citations (PDF)
145Multimode thermoelastic dissipation
Journal of Applied Physics, 2009, 105,
2.092Citations (PDF)
146Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow
Journal of Heat Transfer, 2009, 131,
1.545Citations (PDF)
147Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform
Sensors and Actuators B: Chemical, 2009, 143, 286-294
7.67Citations (PDF)
148A benchmark study on the thermal conductivity of nanofluids
Journal of Applied Physics, 2009, 106,
2.0971Citations (PDF)
149Heat Conduction through a DNA−Gold Composite
Nano Letters, 2009, 9, 2005-2009
8.745Citations (PDF)
150Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance
IEEE Transactions on Advanced Packaging, 2009, 32, 423-430
1.019Citations (PDF)
151Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films
IEEE Electron Device Letters, 2009, 30, 1269-1271
3.3171Citations (PDF)
152Investigation of the natural convection boundary condition in microfabricated structures
International Journal of Thermal Sciences, 2008, 47, 820-824
5.086Citations (PDF)
153Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3ω method
International Journal of Heat and Fluid Flow, 2008, 29, 1456-1461
2.4212Citations (PDF)
154Fully Coupled Nonequilibrium Electron–Phonon Transport in Nanometer-Scale Silicon FETs
IEEE Transactions on Electron Devices, 2008, 55, 220-232
2.790Citations (PDF)
155The Impact of Thermal Boundary Resistance in Phase-Change Memory Devices
IEEE Electron Device Letters, 2008, 29, 1112-1114
3.3116Citations (PDF)
156Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3ω Method
Journal of Heat Transfer, 2008, 130,
1.5120Citations (PDF)
157Diffusion, aggregation, and the thermal conductivity of nanofluids
Applied Physics Letters, 2008, 93,
3.070Citations (PDF)
158Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling
Experiments in Fluids, 2008, 46, 725-736
1.915Citations (PDF)
159Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films
Applied Physics Letters, 2007, 91,
3.0122Citations (PDF)
160Measurement and modeling of liquid film thickness evolution in stratified two-phase microchannel flows
Applied Thermal Engineering, 2007, 27, 1722-1727
6.525Citations (PDF)
161Investigation of two-phase transport phenomena in microchannels using a microfabricated experimental structure
Applied Thermal Engineering, 2007, 27, 1728-1733
6.55Citations (PDF)
162Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates
Journal of Applied Physics, 2007, 101, 093710
2.0325Citations (PDF)
163Thermally and Molecularly Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes
Journal of Physical Chemistry B, 2006, 110, 1502-1505
2.751Citations (PDF)
164Two-Phase Microfluidics for Semiconductor Circuits and Fuel Cells
Heat Transfer Engineering, 2006, 27, 53-63
1.615Citations (PDF)
165Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature
Nano Letters, 2006, 6, 96-100
8.71,748Citations (PDF)
166A hybrid method for bubble geometry reconstruction in two-phase microchannels
Experiments in Fluids, 2006, 40, 847-858
1.914Citations (PDF)
167Thermal Phenomena in Nanoscale Transistors
Journal of Electronic Packaging, Transactions of the ASME, 2006, 128, 102-108
1.7105Citations (PDF)
1683-Omega Measurements of Vertically Oriented Carbon Nanotubes on Silicon
Journal of Heat Transfer, 2006, 128, 1109-1113
1.5222Citations (PDF)
169Review: Multiscale Thermal Modeling in Nanoelectronics
International Journal for Multiscale Computational Engineering, 2005, 3, 107-133
1.353Citations (PDF)
170Phase change phenomena in silicon microchannels
International Journal of Heat and Mass Transfer, 2005, 48, 1572-1582
5.5204Citations (PDF)
171Managing heat for electronics
Materials Today, 2005, 8, 30-35
14.0258Citations (PDF)
172Negative Differential Conductance and Hot Phonons in Suspended Nanotube Molecular Wires
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8.2408Citations (PDF)
173Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures
Journal of Heat Transfer, 2005, 127, 49-58
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174Monte Carlo simulation of Joule heating in bulk and strained silicon
Applied Physics Letters, 2005, 86, 082101
3.074Citations (PDF)
175THERMAL CONDUCTION IN SILICON MICRO- AND NANOSTRUCTURES
Annual Review of Heat Transfer, 2005, 14, 129-168
1.2119Citations (PDF)
176Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements
Applied Physics Letters, 2004, 85, 2086-2088
3.061Citations (PDF)
177Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion
Journal of Applied Physics, 2004, 96, 4998-5005
2.0179Citations (PDF)
178Nucleation and Growth of Vapor Bubbles in a Heated Silicon Microchannel
Journal of Heat Transfer, 2004, 126, 497-497
1.51Citations (PDF)
179Nanoscale thermal transport
Journal of Applied Physics, 2003, 93, 793-818
2.02,849Citations (PDF)
180Submicron thermocouple measurements of electron-beam resist heating
Journal of Vacuum Science & Technology an Official Journal of the American Vacuum Society B, Microelectronics Processing and Phenomena, 2002, 20, 3044
1.533Citations (PDF)
181Thermal Writing and Nanoimaging With a Heated Atomic Force Microscope Cantilever
Journal of Heat Transfer, 2002, 124, 597-597
1.515Citations (PDF)
182Sub-Continuum Simulations of Heat Conduction in Silicon-on-Insulator Transistors
Journal of Heat Transfer, 2001, 123, 130-137
1.5137Citations (PDF)
183Atomic force microscope cantilevers for combined thermomechanical data writing and reading
Applied Physics Letters, 2001, 78, 1300-1302
3.0165Citations (PDF)
184HEAT CONDUCTION IN NOVEL ELECTRONIC FILMS
Annual Review of Materials Research, 1999, 29, 261-293
7.0166Citations (PDF)
185Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries
Diamond and Related Materials, 1998, 7, 1-14
4.823Citations (PDF)
186Thermal Conductivity Measurements of Interlevel Dielectrics
Materials Research Society Symposia Proceedings, 1997, 473,
0.13Citations (PDF)
187IMPACT OF CVD DIAMOND LAYERS ON THE THERMAL ENGINEERING OF ELECTRONIC SYSTEMS
Annual Review of Heat Transfer, 1995, 6, 323-353
1.212Citations (PDF)
188Thermofluidic Visualization of the Capillary-Driven Boiling for Design Optimization of Silicon-Embedded Evaporators
IEEE Transactions on Components, Packaging and Manufacturing Technology, 0, 16, 1499-1512
1.71Citations (PDF)
189DBC-based Embedded Micro-channel Cooler for the High-Power Density Power Module
International Symposium on Microelectronics, 0, 2025,
0.10Citations (PDF)
190Development of capillary-based two-phase microcooler using laser-fabricated hierarchical silicon pin fin/microchannel wick
International Journal of Heat and Mass Transfer, 0, 266, 128857
5.50Citations (PDF)
191Capillary Transport Enhancement in Hybrid Micropillar Wicks Fabricated with UV-Laser Ablation
0, 4, 3168-3175
0Citations (PDF)
192Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink
Applied Thermal Engineering, 0, 303, 131914
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